Slim Connector Plug Using Wafer Level Alignment
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Solution Overview
Problem
Conventional active optical cable (AOC) connectors face challenges in achieving a slim, high-speed data transmission with a thickness of 1 mm while maintaining accurate alignment between optical elements and fibers without misalignment, leading to high manufacturing costs and performance degradation due to wire-bonding issues.
Innovation Solution
The solution involves a slim connector plug and active optical cable assembly that uses a Fan Out Wafer Level Package (FOWLP) and Wafer Level Alignment (WLA) techniques to align optical elements and fibers without substrates, enabling precise passive alignment and eliminating wire-bonding, thereby achieving high accuracy and productivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of moving object
If conventional AOC is packaged on PCB in bonding or COB form, then manufacturing is simplified, but thickness cannot be reduced to 1 mm or less
Solution Approach 1:
The patent replaces the conventional PCB-based mechanical packaging system with a semiconductor wafer-level packaging system. By using wafer-level alignment and bonding techniques, the optical engine achieves a thickness of 1 mm or less while maintaining manufacturing feasibility through automated wafer processing rather than manual PCB assembly.
Solution Approach 2:
The patent transitions from two-dimensional PCB mounting to three-dimensional wafer-level integration. By stacking optical components (VCSEL, lens, photodiode) vertically on a semiconductor substrate and using wafer-level bonding, the design achieves extreme thinness in the Z-direction while integrating all optical functions in a compact volume.
2Manufacturing precision
If passive alignment technique is used without accurate alignment structure, then manufacturing cost increases due to additional active alignment costs, but alignment accuracy between PCBs, optical elements, and optical fibers deteriorates
Solution Approach 1:
The patent incorporates alignment marks and alignment structures during the wafer fabrication process itself, before the actual optical assembly. The alignment marks are pre-formed on the wafer, and the optical elements are positioned relative to these marks during wafer-level bonding, enabling accurate passive alignment without requiring expensive post-assembly active alignment procedures.
Solution Approach 2:
The wafer-level alignment structure enables the system to self-align during the bonding process. The alignment marks and mechanical features on the wafer automatically guide the positioning of optical elements and optical fibers, eliminating the need for external active alignment equipment and reducing manufacturing costs while maintaining high precision.
3Speed
If wire-bonding is used for high-speed interconnection, then electrical connection is achieved, but performance degradation occurs at several tens giga to 100 giga or more
Solution Approach 1:
The patent extracts and eliminates the wire-bonding interconnection method from the system. By using direct wafer-level bonding or conductive paste connections instead of wire bonds, the design removes the source of signal degradation that limits performance at high speeds (several tens giga to 100 giga or more), enabling reliable ultra-high-speed data transmission.
4Manufacturing precision
If optical elements and optical fibers are aligned with accurate structure, then alignment precision is improved, but manufacturing cost increases due to additional active alignment costs
Solution Approach 1:
The patent replaces expensive active alignment systems with a passive wafer-level alignment mechanism. Alignment marks and mechanical features are integrated into the wafer structure during fabrication, enabling precise alignment of optical elements and optical fibers through automated wafer bonding processes without requiring costly active alignment equipment or procedures.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach results in a compact, high-speed data transmission system with reduced manufacturing costs, improved alignment accuracy, and enhanced performance by eliminating misalignment and wire-bonding-related issues, allowing for ultra-high-speed data transfer up to 100 giga or more.
Implementation Method 1
an optical component installed on the reflective surface of the OSA and transmitting the optical signal between the optical fiber and the optical engine
Data Source
AI summary
Provided is an optical element module comprising: a mold body having a first surface formed on an upper portion thereof and a second surface formed on a lower portion thereof; an external connection terminal formed on the first surface and electrically connected to the outside; an optical engine embedded and sealed between the first surface and the second surface and having a connection pad exposed to the second surface; a conductive vertical via formed to penetrate the first surface and the second surface and having one end portion electrically connected to the external connection terminal; a wiring layer formed on the second surface to interconnect the other end of the conductive vertical via and the connection pad of the optical engine; and a reflective surface integrally formed on the wiring layer and transmits an optical signal generated by the optical engine or received by the optical engine.