Slim Camera Flash Module With Segmented Lens And Opaque Molding
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Solution Overview
Problem
Conventional camera flash modules face challenges in achieving a wide angle of view while maintaining slimness, uniform light distribution, and mechanical reliability, with issues such as lens thickness, scratch vulnerability, and heat generation, as well as limitations in emotional lighting and alignment accuracy.
Innovation Solution
A light emitting module design featuring flip-type light emitting chips with different color temperatures, an opaque molding part, and a lens unit with precise light diffusion patterns, integrated within a slim frame structure to enhance alignment accuracy and mechanical reliability, and utilize a phosphor layer for uniform white light emission.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of moving object
If a conventional flash lens is used with certain thickness, then the lens can be manufactured using mold injection, but the angle of view is limited and the module cannot achieve slimness
Solution Approach 1:
The lens is divided into multiple sections with different thicknesses and optical properties. The lens includes a first region with a first thickness and a second region with a second thickness greater than the first thickness, allowing different portions to serve different optical functions and achieve both slimness and wide angle of view
Solution Approach 2:
Different regions of the lens are assigned different local properties - the first region has optimized thickness for wide angle coverage while the second region has increased thickness for specific optical correction functions, creating non-uniform local characteristics throughout the lens structure
2Ease of manufacture
If the lens material is made of plastic for ease of manufacture, then the lens can be easily molded, but the lens becomes vulnerable to scratches
Solution Approach 1:
The lens is constructed from composite materials that combine the manufacturing advantages of plastic with the scratch resistance of harder coatings or material layers, creating a multi-layer structure that exhibits both ease of manufacture and high reliability against scratches
3Area of stationary object
If a wide angle is implemented in the flash lens, then the field of view is expanded, but uniform light distribution becomes difficult to achieve
Solution Approach 1:
The lens incorporates regions with different optical densities and refractive indices to compensate for the non-uniform light distribution that naturally occurs in wide angle lenses, with specific zones optimized for light redirection and uniformity correction
Solution Approach 2:
The lens design utilizes variations in thickness parameters, refractive index parameters, and curvature parameters across different regions to achieve both wide angle coverage and uniform light distribution, with the first and second regions having distinctly different parameter sets
4Adaptability or versatility
If multiple light emitting chips with different color temperatures are used for emotional lighting, then lighting versatility is improved, but alignment accuracy becomes more critical and difficult to maintain
Solution Approach 1:
Multiple light emitting chips with different color temperatures are merged into a single integrated lens assembly, where the lens structure itself provides alignment references and positioning features that maintain precise spatial relationships between the different chips during manufacturing and operation
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables a super slim camera flash module with a wide angle of view, high scratch resistance, improved heat radiation, and uniform light distribution, while supporting emotional lighting and enhanced mechanical reliability.
Implementation Method 1
a phosphor layer disposed on one surface of the semiconductor layer
Data Source
AI summary
An embodiment relates to a light emitting module, a flash module, and a terminal including the same. The light emitting module according to an embodiment comprises: a semiconductor layer; a phosphor layer arranged on one surface of the semiconductor layer; a plurality of light emitting chips including a plurality of electrodes arranged on a surface facing one surface of the semiconductor layer; a first partition arranged at one side of the plurality of light emitting chips, and a second partition arranged at the other side of the plurality of light emitting chips so as to face the first partition; and an opaque molding part, which encompasses the plurality of light emitting chips such that the upper surface of the phosphor layer and the bottom surfaces of the plurality of electrodes are exposed to the outside, and is arranged on the inner side of the first and second partitions. The light emitting module according to the embodiment comprises: a semiconductor layer; a phosphor layer arranged on one surface of the semiconductor layer; a plurality of light emitting chips including a plurality of electrodes arranged on a surface facing one surface of the semiconductor layer; and an opaque molding part, which encompasses the plurality of light emitting chips such that the upper surface of the phosphor layer and the bottom surfaces of the plurality of electrodes are exposed to the outside.