Slim LED Package for Line Curing with Centro-Symmetric Mounting
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Solution Overview
Problem
High-density LED packaging for line curing applications faces challenges with increased system complexity and decreased reliability due to the use of many small chips in close proximity, which can lead to imbalanced current flow and non-uniform emission.
Innovation Solution
A slim LED package design with a centro-symmetric mounting area, additional trace length, and dielectric layers to balance resistance and current flow, allowing for close packing of large-chip LEDs with reduced resistance and improved uniformity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Power
If many small LED chips are placed in close proximity to meet power density requirements, then the optical power density is improved, but the system complexity increases and reliability decreases
Solution Approach 1:
The invention divides the LED system into modular packages, each containing multiple LED chips mounted on a common substrate. This segmentation allows the system to achieve high optical power density through multiple packages while maintaining manageable complexity at the module level, with each package being a self-contained unit that can be independently managed and replaced.
2Power
If many small LED chips are placed in close proximity to meet power density requirements, then the optical power density is improved, but the reliability decreases
Solution Approach 1:
The invention incorporates redundant LED chips within each modular package. This redundancy provides beforehand cushioning against chip failure, ensuring that if one or more chips fail, the package can still maintain its light output by activating remaining chips or replacing the entire module, thereby improving system reliability while maintaining high power density.
3Area of stationary object
If LED chips are placed in close proximity to achieve high-density packaging, then the area efficiency is improved, but current flow becomes imbalanced and emission uniformity decreases
Solution Approach 1:
The invention implements local quality control through individual current regulation circuits for each LED chip or group of chips within the modular package. This allows precise control of current distribution to compensate for variations in chip characteristics and positioning, ensuring uniform emission across the high-density array while maintaining area efficiency.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables balanced current flow and reduced resistance, achieving uniform radiometric flux and increased lumen output, simplifying system integration and maintenance while enhancing reliability and efficiency in line curing systems.
Implementation Method 1
a dielectric layer electrically separating the electrical trace layer and the substrate
Implementation Method 2
a mounting area configured to mount an LED chip
Implementation Method 3
The traditional source of this high power radiation has been mercury lamps. Recently, there has been a strong drive to transition from mercury lamps to UV LEDs.
Data Source
AI summary
A slim LED package configured to handle large current, having a narrow width, an LED chip mounting area positioned centro-symmetrically within the package, mounting holes positioned equidistantly from the mounting area, wherein multiple packages may be arranged with alternating anode and cathode ends in such a manner that a high-power density radiometric flux line may be created. Some embodiments include current density management areas positioned on one more sides of the LED chip mounting area.