Slim Lens with Concave Light Incident Surface for Uniform Illumination
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Solution Overview
Problem
Existing light emitting modules for surface illumination face challenges in achieving a slim structure and uniform light distribution due to the large size of light emitting devices and limited beam angle, leading to light loss and alignment issues.
Innovation Solution
A light emitting module with a chip-level light emitting device mounted directly on the circuit board using flip-chip bonding, coupled with a lens having a concave section for improved light entry and a slanted surface for reduced light loss, allowing for a slim design and enhanced light dispersion.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If a package substrate is used for the light emitting device, then the device structure is complete and functional, but the overall size becomes large and the lens thickness increases
Solution Approach 1:
The patent extracts and removes the package substrate from the light emitting device structure. The LED chip is mounted directly on the circuit board without the intermediate package substrate, thereby reducing the overall device size and enabling a thinner lens structure while maintaining the essential light-emitting function.
Solution Approach 2:
The patent transitions from a three-dimensional package substrate structure to a planar direct-mount structure. By mounting the LED chip directly on the circuit board in a flattened configuration, the vertical height is reduced, allowing for a thinner lens and slimmer overall module design.
2Illumination intensity
If the light emitting device has a narrow beam angle, then the light output is concentrated, but the light dispersion capability is limited
Solution Approach 1:
The patent employs a lens with a curved refractive surface instead of a flat surface. The curved geometry of the lens redirects and disperses the concentrated light from the narrow beam angle LED chip, spreading it over a wider area while maintaining illumination intensity, thus achieving both concentration and dispersion capabilities.
3Device complexity
If the light emitting device is disposed below the lens lower surface, then the structure is simple, but light loss occurs below the lens
Solution Approach 1:
The patent positions the LED chip at a predetermined height within the lens structure, specifically at or near the lower surface level. This preliminary positioning ensures that light is generated at the optimal location for immediate entry into the lens, preventing light loss below the lens while maintaining structural simplicity.
4Strength
If adhesive is applied to attach the lens to the circuit board, then the lens is securely fixed, but adhesive deterioration on the lens surface occurs
Solution Approach 1:
The patent extracts the adhesive application area from the lens surface by providing a separate mounting structure or flange on the lens. The adhesive is applied only to the mounting structure, not directly to the optical surface of the lens, thereby securing the lens firmly to the circuit board while preventing adhesive deterioration on the lens surface.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution reduces light loss and enables uniform light distribution over a wide area with improved alignment tolerance, achieving a slim and efficient light emitting module design.
Implementation Method 1
a lens which disperses light emitted from light emitting devices at a wide angle. The light emitted from the light emitting device is uniformly dispersed through the lens
Implementation Method 2
a concave section defining a light incident surface through which light enters the lens. Since the concave section is disposed above the light emitting device, the light emitted from the light emitting device enters the lens through the light incident surface
Implementation Method 3
a slanted surface surrounding the flat surface. The slanted surface is slanted upwards from the flat surface and has a slope of less than about 10° relative to the flat surface
Data Source
AI summary
A light emitting module includes a circuit board, a light emitting device mounted on the circuit board, and a lens dispersing light emitted from the light emitting device. The lens includes a lower surface formed with a concave section defining a light incident surface through which light enters the lens, an upper surface through which light exits the lens, and legs coupled to the circuit board and disposed farther outside the lens than an area of the upper surface. The light emitting device is disposed within the concave section of the lens.