Slim Lens for Surface Illumination with Reduced Light Loss
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Solution Overview
Problem
Conventional light emitting modules for surface illumination face challenges in slimming the lens and reducing light loss due to the large size of the light emitting device and its package substrate, which limits the distribution of light and results in non-uniform illumination.
Innovation Solution
A light emitting module with a chip-level light emitting device directly mounted on the circuit board, utilizing a lens with a concave portion that has a width no more than twice the width of the device, and an inclination surface with a slope of less than 10 degrees to minimize light loss and enhance uniform light distribution.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If a conventional light emitting device with package substrate is used, then the device can be mounted on the circuit board, but the size of the light emitting device becomes relatively large
Solution Approach 1:
The patent extracts and removes the package substrate from the light emitting device structure. The LED chip is mounted directly on the circuit board without the intermediate package substrate, thereby reducing the overall device size while maintaining mounting capability. This extraction of the unnecessary component resolves the contradiction between ease of manufacture and device size.
Solution Approach 2:
Instead of the conventional approach where the LED chip is enclosed in a package substrate that is then mounted on the circuit board, the patent inverts the mounting structure by directly mounting the LED chip on the circuit board. This inversion eliminates the package substrate layer, reducing device size while simplifying the manufacturing process.
2Ease of manufacture
If the light emitting device size is large, then it can be easily mounted, but the entrance and height of the concave portion must be larger making it difficult to slim the lens
Solution Approach 1:
By removing the package substrate, the patent reduces the vertical height required for mounting the light emitting device. This extraction allows the lens's concave portion to have a smaller entrance and height, enabling the lens to be slimmer while maintaining ease of manufacture through direct chip mounting.
Solution Approach 2:
The patent changes the mounting parameters by eliminating the package substrate layer, which directly reduces the required height of the lens's concave portion. This parameter change enables the lens to be designed with smaller dimensions while maintaining manufacturing ease.
3Ease of manufacture
If the light emitting device is positioned beneath the lower surface of the lens, then it can be mounted on the circuit board, but a portion of the light is lost beneath the lower surface
Solution Approach 1:
The patent extracts the light emitting device from its conventional position beneath the lens lower surface and repositions it directly on the circuit board. This extraction eliminates the light loss that occurs when light is emitted beneath the lens surface, while maintaining mounting capability through direct chip-to-board connection.
Solution Approach 2:
The circuit board serves as an intermediary mounting surface, replacing the conventional position beneath the lens lower surface. By using the circuit board as the mounting intermediary, the patent eliminates light loss while maintaining ease of manufacture through standard PCB mounting techniques.
4Ease of manufacture
If a conventional light emitting device is used, then it can be mounted on the circuit board, but the viewing angle is relatively narrow limiting light distribution
Solution Approach 1:
By removing the package substrate that constrains the LED chip orientation, the patent enables the LED chip to be positioned and oriented optimally for wide-angle light emission. This extraction allows the light emitting device to achieve a wider viewing angle and improved light distribution while maintaining mounting capability.
Solution Approach 2:
The patent changes the mounting parameters by eliminating the package substrate, which allows for optimized LED chip orientation and positioning. This parameter change enables the light emitting device to achieve a wider viewing angle and improved adaptability for light distribution across the display surface.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution allows for a slimmed-down light emitting module with reduced light loss and improved uniformity in light distribution over a wide area, achieving a wider viewing angle and increased alignment tolerance between the light emitting device and the lens.
Implementation Method 1
a lens for distributing light emitted from the light limiting device at a wide angle
Implementation Method 2
The incidence surface 330 is an inner surface of a shell-shaped concave portion 320 formed on the lower surface 310 of the lens 300
Data Source
Figure 1a~1b
Figure 2a~2b
Figure 2c~2d
AI summary
An exemplary embodiment of the present invention discloses a light-emitting module including a circuit board, a light-emitting device disposed on the circuit board, and a lens disposed on the circuit board and configured to distribute light emitted from the light emitting device. The lens includes a concave portion having an incidence surface configured to receive incident light emitted from the light-emitting device, and the light emitting device is disposed within the concave portion of the lens.