Slim Vapor Chamber Segmented Flow Channels
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Solution Overview
Problem
Conventional vapor chambers in electronic products face challenges with reduced heat conducting efficiency due to smaller internal spaces in thinner designs, misalignment of supporting pillars during assembly, and non-directional vapor flow, which decreases the flow speed of the evaporated working fluid.
Innovation Solution
A slim vapor chamber design featuring first and second plates connected peripherally with a capillary structure, where supporting structures such as pillars and plates are formed by an etching process to enhance the flow speed of the evaporated working fluid, allowing for improved heat conduction efficiency while maintaining a thin profile.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of moving object
If the vapor chamber is made thinner to match the thinner shape of electronic products, then the thickness of the vapor chamber is reduced, but the internal space for flowing vapor decreases, thereby reducing the flow speed of vapor and heat conducting ability
Solution Approach 1:
The internal space of the vapor chamber is segmented into multiple flow channels by dividing walls, which guide vapor flow in specific directions and prevent short-circuiting. This segmentation allows the thin vapor chamber to maintain efficient vapor flow paths despite the reduced overall thickness.
Solution Approach 2:
The patent introduces vertical flow channels that extend through the thickness of the vapor chamber, utilizing the third dimension to create efficient flow paths. This dimensional approach allows vapor to flow effectively through the thin structure by exploiting the vertical dimension rather than relying solely on horizontal flow space.
2Ease of manufacture
If conventional assembling processes are used to manufacture the vapor chamber, then multiple components can be assembled, but the placement and positioning of supporting pillars becomes difficult, leading to misalignment and decreased performance
Solution Approach 1:
The supporting pillars and flow channels are merged into a single integrated structure formed by the dividing walls. This integration eliminates the need for separate placement and positioning of supporting pillars, as they are automatically positioned during the formation of the flow channels, thereby improving both manufacturing ease and positioning precision.
Solution Approach 2:
The supporting pillars and flow channel structures are pre-formed as integrated components before the final assembly of the vapor chamber. This preliminary formation ensures precise positioning is built into the structure itself, eliminating alignment issues that would arise during subsequent assembly operations.
3Device complexity
If the vapor flow is non-directional as in conventional designs, then the structure is simpler, but the temperature difference between heat and cold ends becomes obvious and heat conducting efficiency cannot be improved
Solution Approach 1:
The internal space is segmented into directional flow channels that guide vapor from the heat source to the cold end in a controlled manner. This segmentation creates unidirectional flow paths that maintain temperature gradients and improve heat conducting efficiency without requiring complex external control mechanisms.
Solution Approach 2:
The dividing walls act as intermediaries that organize and direct the vapor flow between the heat source and cold end. These intermediate structures create the necessary flow directionality and prevent short-circuiting, thereby improving heat conducting efficiency while maintaining relatively simple overall structure.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The enhanced vapor flow speed and heat conduction efficiency improve the thermal management capabilities of electronic products, ensuring better performance and longevity by maintaining a thinner size with improved heat dissipation.
Implementation Method 1
the working fluid flows back to the heat source through the capillary structure
Implementation Method 2
the generated heat can be carried away by the phase change and flow of the working fluid in the vapor chamber
Implementation Method 3
At least one of a side of the first plate facing the second plate and a side of the second plate facing the first plate is formed with a plurality of supporting structures by an etching process
Data Source
AI summary
A slim vapor chamber includes a first plate, a second plate and a capillary structure. The periphery of the second plate is connected with that of the first plate to form a chamber. The capillary structure is disposed on an inner wall of the chamber. Both of a side of the first plate facing the second plate and a side of the second plate facing the first plate are formed with a plurality of supporting structures, which include a plurality of supporting pillars and a plurality of supporting plates, by an etching process.