Slip-Plane MEMS Probe for High-Density Interconnect Testing

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Solution Overview

Problem

The miniaturization of semiconductive device packages creates challenges for probing and testing interconnects, as existing technologies struggle to maintain stable contact resistance and prevent permanent deformation during probe overtravel while managing bending stresses effectively.

Innovation Solution

A composite MEMS probe beam with a slip plane along the sagittal axis, where each beam is individually anchored to a probe base, allowing the primary and subsequent probe arms to deflect and share stresses, reducing overall bending stresses and enabling stable contact resistance during overtravel.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Quantity of substance

If miniaturization of semiconductive device packages is implemented, then device density and integration are improved, but probing and testing interconnects becomes more difficult with smaller spaces available

Engineering Contradiction:

Improvedevice densityVSAvoidprobing accessibility

Core Design Contradiction:

Quantity of substanceVSEase of operation

Solution Approach 1:

The probe card is divided into multiple independent probe beams arranged in an array, each capable of independently accessing specific interconnect locations. This segmentation allows high-density probing while maintaining individual probe accessibility through separate deflection paths.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The probe beams utilize out-of-plane deflection (Z-direction) to access interconnects, transitioning from traditional in-plane probing. This dimensional change enables probing of densely packed interconnects by exploiting the third dimension for access paths.

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

2Measurement precision

If probe overtravel is increased to accommodate misalignment, then alignment tolerance is improved, but contact resistance stability deteriorates and permanent deformation occurs

Engineering Contradiction:

Improvealignment toleranceVSAvoidcontact resistance stability

Core Design Contradiction:

Measurement precisionVSReliability

Solution Approach 1:

The probe beams are designed with controlled flexibility to dynamically adjust their deflection during contact. This dynamic behavior allows the probe to accommodate misalignment through elastic deflection while maintaining stable contact force and resistance, preventing permanent deformation.

Inventive Principle:

Principle #15Dynamics

Solution Approach 2:

The probe beam physical parameters (thickness, width, material properties) are optimized to achieve specific deflection characteristics. By controlling the beam's flexural rigidity, the system allows sufficient overtravel for alignment tolerance while maintaining contact force within a stable range for consistent resistance.

Inventive Principle:

Principle #35Parameter changes

3Strength

If bending stresses are increased to maintain probe rigidity, then probe strength is improved, but permanent deformation during overtravel occurs

Engineering Contradiction:

Improveprobe rigidityVSAvoidpermanent deformation

Core Design Contradiction:

StrengthVSManufacturing precision

Solution Approach 1:

The probe beams are designed as thin flexible structures with controlled rigidity. This flexible design allows the probe to bend elastically during overtravel and deflection, accommodating misalignment and contact forces without permanent deformation, while still maintaining sufficient structural strength.

Inventive Principle:

Principle #30Flexible shells and thin films

Solution Approach 2:

The probe beam design incorporates elastic compliance that acts as a cushion during contact. This pre-designed flexibility absorbs excessive contact forces and misalignment stresses through elastic deformation, preventing permanent damage before it occurs.

Inventive Principle:

Principle #11Beforehand cushioning (Prior cushioning)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This solution allows for reliable and repeated high-density testing without permanent deformation, maintaining stable contact resistance and reducing bending stresses through the shared stress mechanism of the composite probe beam.

Implementation Method 1

allowing the primary and subsequent probe arms to deflect and share stresses, reducing overall bending stresses

Methodology Applied

Scientific EffectElastic deformation: Elasticity

Data Source

PatentUS11372023B2Slip-plane MEMs probe for high-density and fine pitch interconnects

Publication Date: 2022.06.28 INTEL CORP

AI summary

A device probe includes a primary probe arm and a subsequent probe arm with a slip plane spacing between the primary probe arm and subsequent probe arm. Each probe arm is integrally part of a probe base that is attachable to a probe card. During probe use on a semiconductive device or a semiconductor device package substrate, overtravel of the probe tip allows the primary and subsequent probe arms to deflect, while sufficient resistance to deflection creates a useful contact with an electrical structure such as an electrical bump or a bond pad.