Slip Ring Impedance Matching via Axial Spacing

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Solution Overview

Problem

High-frequency signal transmission across slip rings in turbomachines is limited by impedance discontinuities, leading to signal distortion and degradation, which is exacerbated by the limited axial space in slip ring assemblies, restricting the number of sensors that can be used.

Innovation Solution

The implementation of a slip ring assembly with conductive rings electronically coupled via twisted wire pairs of constant target impedance, axially spaced to maintain impedance matching across the rings, ensuring clear transmission of high-frequency signals.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If the contact surface area of conductive rings is increased to mitigate impedance mismatches, then signal transmission quality improves, but the number of conductive rings that can be accommodated along the axial length decreases

Engineering Contradiction:
Improvesignal transmission qualityVSAvoidnumber of sensors supported
Core Design Contradiction:
ReliabilityVSProductivity

Solution Approach 1:

The patent applies parameter changes by precisely controlling the axial spacing between conductive rings to maintain constant target impedance for high-frequency signals. By optimizing the distance parameter between rings rather than changing contact surface area, the invention achieves impedance matching while preserving axial space for multiple sensor connections.

Inventive Principle:
Principle #35Parameter changes

2Productivity

If multiple sensors are connected to the slip ring assembly, then data transmission capability improves, but impedance discontinuities increase causing signal distortion

Engineering Contradiction:
Improvedata transmission capabilityVSAvoidsignal integrity
Core Design Contradiction:
ProductivityVSReliability

Solution Approach 1:

The patent resolves this contradiction by changing the axial spacing parameter between conductive rings to maintain constant impedance. This allows multiple sensors to be connected without creating impedance discontinuities, as each ring is positioned at a specific distance from others to preserve signal integrity across all connections.

Inventive Principle:
Principle #35Parameter changes

3Ease of operation

If the axial length of the slip ring assembly is reduced, then installation space improves, but the number of conductive rings that can be accommodated decreases

Engineering Contradiction:
Improveinstallation spaceVSAvoidnumber of sensors supported
Core Design Contradiction:
Ease of operationVSProductivity

Solution Approach 1:

The patent optimizes the axial spacing parameter between conductive rings to achieve constant impedance matching. This precise parameter control allows maximum utilization of available axial space, enabling more conductive rings to be accommodated in shorter assemblies while maintaining signal quality for high-frequency transmissions.

Inventive Principle:
Principle #35Parameter changes

Data Source

PatentUS9240660B1Slip ring assembly and method for impedance matching high frequency signals across the slip ring assembly
Publication Date: 2016.01.19 GE INFRASTRUCTURE TECH LLC
  • US9240660B1 patent drawing
  • US9240660B1 patent drawing
  • US9240660B1 patent drawing

AI summary

A slip ring assembly includes a pair of conductive rings consecutively positioned along a center shaft of the slip ring assembly. The pair of conductive rings are electronically coupled to a high frequency signal source via a first twisted wire pair. The pair of conductive rings are electronically coupled to a data processor via a second twisted wire pair. The first and second twisted wire pairs have constant target impedances that are substantially similar. The first and second conductive rings are axially spaced at an axial distance that is sized so as to maintain the constant target impedance across the first and second conductive rings during transmission of a high frequency signal from the high frequency signal source to the data processor. The slip ring assembly provides a method for impedance matching across the conductive rings of the slip ring assembly.