Slit Clip Package Layout for Compact Semiconductor Interconnects
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Solution Overview
Problem
The arrangement of conductive pins or posts in semiconductor device packages occupies large areas, limiting design flexibility and substrate layout, and increasing the size of passive components.
Innovation Solution
A semiconductor device package design featuring a clip with a slit-separated first and second portion, supported by a substrate and encapsulant, allowing for reduced area occupation and enhanced structural stability, enabling more flexible component arrangement and miniaturization.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conductive pins or posts are disposed directly under passive components for electrical connection, then electrical connectivity is achieved, but device area is occupied and design flexibility is reduced
Solution Approach 1:
The conductive element is segmented into a first portion extending from the substrate and a second portion extending from the passive component, with the slit separating these portions. This segmentation allows the conductive path to be achieved without requiring a continuous pin or post occupying the entire vertical space, thereby reducing the device area while maintaining electrical connectivity.
Solution Approach 2:
The conductive material is extracted and redistributed into portions located at the substrate and passive component interfaces, with the intermediate region (where the slit is formed) having reduced or removed conductive material. This extraction eliminates the need for bulky conductive pins occupying device area while preserving the essential electrical connection function.
2Reliability
If conductive pins or posts are used for connecting passive components to substrate, then electrical connection is established, but substrate layout flexibility is adversely affected
Solution Approach 1:
By segmenting the conductive element into separate portions at the substrate and passive component interfaces with a slit in between, the design allows for greater flexibility in substrate layout. The segmented structure can be adapted to various component arrangements without requiring fixed pin locations, thereby enhancing substrate layout flexibility while maintaining reliable electrical connection.
Data Source
AI summary
A semiconductor device package and a method for manufacturing a semiconductor device package are provided. The semiconductor device package includes a substrate, a clip, and a support structure. The clip is disposed on the substrate. The clip includes a first portion and a second portion separated from each other by a slit. The support structure is above the substrate and supports the clip. The support structure has a first surface and a second surface facing the first surface, and the first surface and the second surface define a gap.