Slit Socket Terminal Structure for Reliable Semiconductor Testing
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Solution Overview
Problem
The reliability of electrical tests on semiconductor devices is compromised due to inadequate contact conditions between test terminals and external terminals, leading to increased manufacturing costs from frequent replacement of deteriorated test terminals.
Innovation Solution
A socket terminal with a curved support portion, a plate-shaped portion, and a tip portion having a slit is designed to ensure reliable contact with semiconductor devices, allowing for dual contact points and reducing temperature-related defects, thereby improving test reliability and extending the life of the test terminals.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a conventional test terminal is used for electrical testing, then the testing can be performed, but the contact condition between test terminal and external terminal is inadequate, leading to unreliable electrical test results
Solution Approach 1:
The support portion is designed with a curved shape instead of a straight configuration. This curvature allows the test terminal to flex and adapt to positional variations in the external terminal, ensuring reliable contact conditions and improving electrical test reliability by compensating for manufacturing tolerances and alignment variations.
Solution Approach 2:
The tip portion is divided into multiple contact portions separated by slits, transforming a single contact point into multiple contact points. This segmentation enables simultaneous contact with multiple external terminals or provides redundant contact paths, thereby improving contact reliability and reducing the risk of test failures.
2Productivity
If electrical tests are performed on a large number of semiconductor devices, then production volume increases, but test terminals deteriorate and require frequent replacement, increasing manufacturing cost
Solution Approach 1:
The curved support portion acts as a stress-absorbing element that flexes during repeated contact cycles. This curvature design distributes mechanical stress along the terminal structure rather than concentrating it at the tip, reducing wear and extending the operational life of the test terminal during high-volume testing.
Solution Approach 2:
The slits in the tip portion create independent contact portions that can wear independently. If one contact portion deteriorates, the others remain functional, extending the overall terminal lifespan and reducing the frequency of replacements during high-volume production testing.
3Reliability
If contact is made between test terminal and external terminal, then electrical testing is enabled, but local temperature rise occurs due to contact resistance, causing defects
Solution Approach 1:
The tip portion is divided into multiple contact portions separated by slits, creating multiple parallel contact paths. This segmentation distributes the electrical current across multiple contact points, reducing the current density and contact resistance at each individual contact point, thereby minimizing local temperature rise and preventing thermal defects during electrical testing.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The socket terminal design enhances the reliability of electrical tests by reducing contact resistance and preventing local temperature rises, leading to improved manufacturing yield and reduced costs associated with frequent replacements.
Implementation Method 1
a main body portion including a curved support portion; a plate-shaped portion integrally connected to the support portion
Implementation Method 2
bringing, after the step (a) and the step (b), the inspection terminal into contact with the external terminal of the semiconductor package, and performing an electrical test
Data Source
AI summary
An inspection terminal provided in a test device has a main body portion including a support portion that is curved; a plate-shaped portion integrally connected to the support portion and extending in a first direction; a tip portion integrally connected to the plate-shaped portion and having a larger dimension in a second direction intersecting with the first direction than that of the plate-shaped portion in the second direction; and a slit formed from the tip portion to the plate-shaped portion so as not to reach the support portion of the inspection terminal. The tip portion of the inspection terminal has a first contact portion and a second contact portion that are separated from each other by way of via the slit, and each contact portion is brought into contact with an external terminal of a semiconductor package, and an electrical test of the semiconductor package is performed.