Slit Support Tube Assembly for High-Temperature Process Tube Stability

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Solution Overview

Problem

Semiconductor process tubes made from quartz deform at high temperatures, while SiC tubes are expensive and prone to oxidation, leading to contamination and short circuits, necessitating a more stable and cost-effective solution for high-temperature semiconductor processing.

Innovation Solution

A process assembly featuring a hollow support tube with a slit along its longitudinal direction to stabilize a hollow process tube, allowing it to maintain shape and prevent deformation at high temperatures, while minimizing thermal expansion issues and optimizing heat transfer.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If quartz process tubes are used at high temperatures above 1,050°C, then the process tube can be operated at high temperature, but the quartz tube deforms under its own weight causing plastic deformation and oval flattening

Engineering Contradiction:
Improveoperating temperatureVSAvoidtube shape stability
Core Design Contradiction:
TemperatureVSShape

Solution Approach 1:

The support tube is divided into multiple sections along its longitudinal direction, with each section capable of independent deformation. This segmentation allows the support tube to accommodate thermal expansion and stress distribution, preventing overall tube deformation while maintaining structural integrity at high temperatures

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The support tube is arranged coaxially around the process tube, with the process tube nested inside the support tube. This nested configuration provides external structural support to the process tube, preventing it from deforming under high temperature conditions while allowing the process tube to maintain its functional integrity

Inventive Principle:
Principle #7Nested doll (Nesting)

2Shape

If SiC process tubes are used to avoid deformation, then shape stability is improved, but the cost increases significantly and oxidation occurs forming silicon oxide layers that trap contaminants

Engineering Contradiction:
Improvetube shape stabilityVSAvoidmanufacturing cost
Core Design Contradiction:
ShapeVSEase of manufacture

Solution Approach 1:

The support tube acts as an intermediary structural element that provides mechanical support to the process tube. By separating the support function (performed by the support tube) from the process function (performed by the process tube), the system can use a lower-cost quartz process tube while maintaining shape stability through the external support structure

Inventive Principle:
Principle #24Intermediary (Mediator)

Solution Approach 2:

The support tube is designed as a replaceable component that can be easily removed and replaced when deformed. This allows the use of lower-cost materials for the support tube rather than expensive SiC, as the support tube can be discarded and replaced rather than the entire system needing to be made from durable materials

Inventive Principle:
Principle #27Cheap short-living objects (Disposable)

3Shape

If SiC process tubes are used, then shape stability is improved, but oxygen introduces oxidation forming silicon oxide layers that act as sinks for unwanted materials causing contamination

Engineering Contradiction:
Improvetube shape stabilityVSAvoidcontamination risk
Core Design Contradiction:
ShapeVSObject-affected harmful factors

Solution Approach 1:

The support tube serves as a mediator that provides mechanical support without contacting the process atmosphere. By placing the support tube outside the process tube, it prevents oxidation and contamination of the process tube while still providing the necessary structural support to maintain shape stability

Inventive Principle:
Principle #24Intermediary (Mediator)

Solution Approach 2:

The support tube is designed as a disposable component that can be easily replaced. This allows the use of simpler materials that don't require oxidation resistance, as the support tube is replaced rather than maintained, eliminating the contamination issue while keeping costs low

Inventive Principle:
Principle #27Cheap short-living objects (Disposable)

4Shape

If SiC process tubes are used, then shape stability is improved, but heating element deformations cause contact between the process tube and heating element leading to short circuits

Engineering Contradiction:
Improvetube shape stabilityVSAvoidelectrical short circuit risk
Core Design Contradiction:
ShapeVSReliability

Solution Approach 1:

The support tube is segmented into multiple sections that can independently deform and adjust. This segmentation absorbs thermal expansion and heating element deformations, preventing the process tube from contacting the heating element and avoiding short circuits while maintaining overall shape stability

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The support tube is designed with sufficient flexibility to accommodate heating element deformations and thermal expansion. This flexible design allows the support tube to maintain the process tube's position and prevent contact with the heating element, eliminating short circuit risks while preserving shape stability

Inventive Principle:
Principle #30Flexible shells and thin films

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution provides a robust, stable, and cost-effective semiconductor processing environment by preventing plastic deformation and contamination, ensuring reliable high-temperature operation and extended service life of the process tubes.

Implementation Method 1

When arranged horizontally and operated continuously at operating temperatures above 1,000° C., process tubes fabricated from a material comprising quartz could deform under their own weight

Methodology Applied
Scientific EffectGravitational force: Gravitation

Implementation Method 2

a hollow support tube having a slit running along a longitudinal direction of said support tube; and a hollow process tube defining a process volume for a semiconductor process, said process tube being arranged, at least sectionally, within said support tube and said support tube supporting said process tube

Methodology Applied
Scientific EffectThermal expansion: Thermal Expansion

Data Source

PatentUS20240355649A1Process assembly for semiconductor processing and semiconductor processing method
Publication Date: 2024.10.24 CENTROTHEM PHOTOVOLTAICS AG
  • US20240355649A1 patent drawing
  • US20240355649A1 patent drawing
  • US20240355649A1 patent drawing

AI summary

A process assembly is specifically suited for use in a semiconductor process, the integration of the process assembly for processing a semiconductor product, and a method for processing a semiconductor product. The process assembly has a hollow support tube that is formed with a slit. The slit runs along a longitudinal direction of the support tube. A hollow process tube provides a process volume for a semiconductor process. The process tube is arranged within the support tube, at least sectionally, such that the support tube supports the process tube.