Sloped Die Interconnector for High-I/O Stacked Package Stability
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Traditional interconnect technologies, such as wire bonding, are insufficient for the increased number of inputs and outputs in high-density integrated circuit dies, leading to issues like die tilt, warpage, and structural failures in three-dimensional assembly structures.
Innovation Solution
A sloped interconnector with a mechanical support structure that provides both mechanical and electrical support for stacked integrated circuit dies, featuring a sloped surface at a non-perpendicular and non-parallel angle, allowing for improved alignment and electrical interfacing through solder bumps and conductive pillars.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If traditional interconnect technologies (wire bonding) are used, then device complexity is reduced, but the number of inputs and outputs is insufficient for high-density integrated circuit dies
Solution Approach 1:
The patent merges mechanical support and electrical interconnection functions into a single integrated structure. The mechanical support structure incorporates conductive elements that simultaneously provide structural stability and electrical connectivity, eliminating the need for separate wire bonding processes and enabling higher I/O density without proportionally increasing device complexity
Solution Approach 2:
The patent transitions from two-dimensional planar interconnection to three-dimensional vertical stacking with lateral offset. Multiple dies are stacked in the vertical dimension with lateral offset positioning, allowing electrical contacts to be made through conductive pillars that extend vertically and laterally, thereby increasing the number of available I/O connections without expanding the footprint
2Productivity
If three-dimensional assembly structures (multi-die stacks) are implemented, then productivity is improved, but mechanical support is insufficient causing die tilt, warpage, and structural failures
Solution Approach 1:
The patent employs asymmetric design in the mechanical support structure with a sloped surface rather than a perpendicular configuration. The sloped surface is angled relative to the substrate, and the conductive pillars are positioned and oriented to match this asymmetry, enabling proper alignment and mechanical support for laterally offset stacked dies while preventing tilt and warpage
Solution Approach 2:
The patent changes the geometric parameters of the mechanical support structure, specifically the angle of the sloped surface and the positioning of conductive pillars. By adjusting these parameters, the structure provides optimal mechanical support and alignment for three-dimensional die stacking, preventing structural failures while maintaining productivity
3Quantity of substance
If laterally offset stacked dies are used, then electrical communication is improved, but alignment precision becomes more difficult to achieve
Solution Approach 1:
The patent incorporates preliminary alignment features in the mechanical support structure, including the sloped surface geometry and conductive pillar positioning, that guide and pre-align the laterally offset stacked dies during assembly. This preliminary action facilitates accurate alignment without requiring extremely precise manual or automated positioning, thereby maintaining manufacturing feasibility
Data Source
AI summary
A semiconductor device package includes a mechanical support structure that provides mechanical support to a stack of dies, where the dies are laterally offset from each other. The support structure has a sloped surface that is disposed at a non-perpendicular and non-parallel angle to other surfaces of the mechanical support structure. Electrical contacts are disposed on the sloped surface of the mechanical support structure for electrically interfacing with the stacked dies and on a different surface of the mechanical support structure for electrically interfacing with a substrate.