Sloped Mold for Uniform EMS Layer in Semiconductor Packages
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Solution Overview
Problem
Existing semiconductor packages face challenges in achieving uniform electromagnetic shielding (EMS) due to thickness differences between top and side surfaces of the EMS layer, which can degrade EMS characteristics, especially when the molding material has angled corners, leading to reduced EMS functionality.
Innovation Solution
The method involves forming a semiconductor package by mounting devices on a substrate, using a mold with inner side surfaces that have a slope to ensure uniform coverage of the EMS layer on both top and side surfaces, allowing for effective electromagnetic shielding even when the molding material has angled corners.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a conventional mold with vertical walls is used to encapsulate the semiconductor device, then the molding process is simple, but the EMS layer thickness becomes non-uniform on top and side surfaces
Solution Approach 1:
The mold structure transitions from symmetric vertical walls to asymmetric sloped walls. The inner side surfaces of the mold are configured with slopes rather than vertical walls, creating an asymmetric geometry that ensures uniform EMS layer deposition on both top and side surfaces of the encapsulated device.
Solution Approach 2:
The geometric parameters of the mold are changed by introducing sloped surfaces with specific angles. This parameter modification to the mold structure enables the EMS layer to achieve uniform thickness across different surfaces during the coating process.
2Reliability
If the molding material has angled corners, then the package structure is formed, but the EMS layer thickness becomes insufficient at corners leading to degraded EMS characteristics
Solution Approach 1:
The mold is pre-configured with sloped walls before the EMS layer deposition process. This preliminary structural preparation ensures that when the EMS layer is applied, it achieves uniform thickness including at corner regions, preventing insufficient coverage that would degrade shielding effectiveness.
Data Source
AI summary
Provided is a method of manufacturing a semiconductor package. The method includes mounting a semiconductor device on a substrate; disposing a mold on the substrate, wherein the mold is formed to cover the semiconductor device such that at least one inner side surface of the mold has a slope; providing a molding material into the mold to encapsulate the semiconductor device; removing the mold from the substrate; and forming an electromagnetic shielding (EMS) layer to cover a top surface and side surfaces of the molding material.