Sloped Wiring Unit for Semiconductor Light Emitting Device

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Solution Overview

Problem

Semiconductor light emitting devices face challenges in maintaining high luminance efficiency due to increased current density and heating issues, which can be exacerbated by the isolation process that reduces the effective light emitting area, making it difficult to achieve uniform current distribution and high production yield.

Innovation Solution

A semiconductor light emitting device structure is developed with a substrate and semiconductor laminate divided into multiple light emitting cells, where the wiring unit is positioned on a lateral surface with a gentler slope than other regions, minimizing the reduction in effective light emitting area and ensuring efficient electrical connections.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If the isolation process is performed to divide the epitaxial layer into multiple LED cells, then the current density problem is alleviated, but the effective light emitting area is drastically reduced

Engineering Contradiction:
Improvecurrent density uniformityVSAvoideffective light emitting area
Core Design Contradiction:
Manufacturing precisionVSArea of stationary object

Solution Approach 1:

The patent applies local quality by creating different slope characteristics in different regions of the LED cell lateral surfaces. Specifically, the wiring formation region has a gentle slope to facilitate metal deposition, while other regions maintain steeper slopes to preserve light emitting area. This localized differentiation resolves the contradiction by allowing the isolation process to proceed while minimizing the impact on the effective light emitting area.

Inventive Principle:
Principle #3Local quality

2Ease of manufacture

If the lateral surfaces are made sufficiently sloped for easy metal deposition, then the wiring formation is facilitated, but the effective light emitting area is reduced

Engineering Contradiction:
Improvewiring deposition easeVSAvoideffective light emitting area
Core Design Contradiction:
Ease of manufactureVSArea of stationary object

Solution Approach 1:

The patent implements local quality by differentiating the slope angles in different regions. The wiring formation region has a gentle slope (first slope angle) that facilitates metal deposition, while other regions have steeper slopes (second slope angle greater than the first) that preserve the effective light emitting area. This localized approach allows easy wiring formation without sacrificing overall light emitting area.

Inventive Principle:
Principle #3Local quality

3Power

If the rated current is increased to obtain high luminous flux, then the output is improved, but the current density increases and luminance efficiency degrades

Engineering Contradiction:
Improveluminous flux outputVSAvoidluminance efficiency
Core Design Contradiction:
PowerVSLoss of energy

Solution Approach 1:

The patent applies segmentation by dividing the epitaxial layer into multiple LED cells through the isolation process. This creates multiple separate light emitting regions that can be independently optimized. By segmenting the structure, the current density is distributed across multiple cells rather than concentrated in a single large cell, allowing high total output while maintaining efficient current distribution and luminance efficiency in each individual cell.

Inventive Principle:
Principle #1Segmentation

Data Source

PatentUS9373746B2Manufacturing method of semiconductor light emitting device having sloped wiring unit
Publication Date: 2016.06.21 SAMSUNG ELECTRONICS CO LTD
  • US9373746B2 patent drawing
  • US9373746B2 patent drawing
  • US9373746B2 patent drawing

AI summary

A semiconductor light emitting device includes a substrate, a semiconductor laminate disposed on the substrate and divided to a plurality of light emitting cells with an isolation region, and a wiring unit electrically connecting the plurality of light emitting cells. A region of lateral surfaces of each of the light emitting cells in which the wiring unit is disposed has a slope gentler than slopes of other regions of the lateral surfaces of each of the light emitting cells.