Slot Antenna Waveguide Diffusion Bonding Low Loss
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Solution Overview
Problem
Existing high-frequency modules face challenges in connecting slot antennas to high-frequency packages in the millimeter-wave band due to mismatched connection sizes and signal propagation losses, particularly when using diffusion bonding techniques.
Innovation Solution
A high-frequency module design that integrates a slot antenna with a radiation waveguide plate, power-supply slot plate, and waveguide plate, connected via conductive members to a high-frequency package with a dielectric waveguide, allowing for precise alignment and reduced signal loss through diffusion bonding of thin plates.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If diffusion bonding is used to connect slot antenna plates, then production cost is reduced, but connection precision between waveguide terminals and power supply slots deteriorates due to layout mismatch
Solution Approach 1:
The antenna structure is divided into multiple separate plates (slot plate, waveguide plate, power supply plate) that are connected through diffusion bonding. This segmentation allows each plate to be manufactured independently with precise features, then joined together, resolving the contradiction between low-cost manufacturing and connection precision.
Solution Approach 2:
The waveguide plate serves as an intermediary component between the slot plate and power supply plate. It provides waveguide trenches that connect the radiation slots to the power supply slots, enabling precise alignment and connection while maintaining the diffusion bonding manufacturing process.
2Adaptability or versatility
If waveguide terminal interval is reduced to match high-frequency package size, then package integration is improved, but signal propagation loss increases due to shorter connection paths
Solution Approach 1:
The waveguide trenches are configured to extend in the depth direction (third dimension) rather than only in the plane direction. This allows the waveguide terminals to be positioned closer together in the horizontal plane for better package integration, while maintaining sufficient signal propagation path length through vertical extension, thus reducing signal loss.
Solution Approach 2:
The waveguide trenches are nested within the waveguide plate structure, allowing compact arrangement of multiple waveguide terminals in close proximity while maintaining adequate signal propagation paths through the nested three-dimensional configuration.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design enables low-cost production of high-frequency modules with minimized signal loss between the radiation slot and waveguide terminal, improving connectivity and reducing production costs while maintaining mechanical strength and efficiency.
Implementation Method 1
a signal propagation loss of the connection path needs to be minimized
Implementation Method 2
there is known a technique of integrally connecting a slot plate to a substrate formed with waveguide trenches, by diffusion bonding
Data Source
AI summary
A high-frequency module has an antenna configured by integrally connecting a slot plate laid out with radiation slots to a plate having plural thin plates formed with a waveguide for supplying power to the slot plate, using a diffusion bonding. The waveguide of the antenna is connected to a dielectric waveguide of a high-frequency package via a waveguide provided on a resin substrate, thereby configuring a slot antenna at low cost, and connecting a power-supply slot of the slot antenna to a waveguide terminal of the high-frequency package with low loss.