Slot-Mountable Rack Cooling Module With Passive Phase Change Cooling
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Solution Overview
Problem
Current electronics rack mounts rely on inefficient cooling methods such as air cooling, liquid cooling, and heat pipes, which are costly, require specific installations, and are inadequate for high-power applications, leading to overheating issues.
Innovation Solution
A slot-mountable rack mount module containing materials that absorb heat through phase changes or endothermic reactions, allowing for efficient and scalable cooling without the need for external components.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If air cooling is used, then cooling function is provided, but it is loud and requires air intake and exhaust
Solution Approach 1:
The patent replaces mechanical air cooling systems with passive phase change materials that absorb heat through phase transitions, eliminating the need for fans, air intakes, and exhaust systems, thereby reducing noise and simplifying the cooling architecture
Solution Approach 2:
The patent utilizes phase change materials that transition between solid and liquid states to absorb and store thermal energy, providing effective cooling without mechanical components, noise, or air flow requirements
2Temperature
If liquid cooling is used, then cooling function is provided, but it requires external reservoirs and pumps
Solution Approach 1:
The patent extracts and eliminates the need for external reservoirs and pumps by integrating phase change materials directly into the rack mount structure, allowing the cooling function to be achieved through the inherent phase transition properties of the materials without external support systems
Solution Approach 2:
The phase change materials provide self-regulating cooling by automatically absorbing heat when temperature increases and releasing it when temperature decreases, eliminating the need for externally controlled pumps and reservoirs
3Temperature
If heat pipes are used, then cooling function is provided, but it requires specific condenser location which can be expensive and is inadequate for high power applications
Solution Approach 1:
The phase change materials can be deployed in various configurations and locations within the rack mount structure to address cooling needs across different power levels and applications, replacing the location-specific heat pipe condenser design with a more versatile solution
Solution Approach 2:
The patent changes the thermal management approach from fixed-parameter heat pipes to variable-parameter phase change materials that can adapt to different heat loads and configurations, providing a more flexible and scalable cooling solution for varying power requirements
4Temperature
If specific cooling channels are used, then cooling function is provided, but it requires design time and custom interfaces for each platform
Solution Approach 1:
The patent divides the cooling system into modular rack mount units with standardized interfaces, allowing phase change materials to be integrated into discrete, replaceable modules that can be configured for different platforms without custom design work
Solution Approach 2:
The phase change materials are pre-integrated into standardized rack mount modules during manufacturing, allowing for quick deployment and interchangeability across different platforms without requiring platform-specific design or customization
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Provides effective heat absorption, extending system operational duration and simplifying mission equipment scaling, suitable for various platforms including attritable and expendable systems.
Implementation Method 1
The at least one material is configured to absorb heat from within the electronics rack mount based at least on at least one phase change of at least one of the at least one material
Implementation Method 2
The at least one material is configured to absorb heat from within the electronics rack mount based at least on at least one of (a) at least one phase change of at least one of the at least one material or (b) at least one endothermic reaction of one or more of the at least one material
Data Source
AI summary
A system includes a slot-mountable rack mount module. The slot-mountable rack mount module is shaped and sized to be mountable into a given rack mount slot of an electronics rack mount. The electronics rack mount has multiple rack mount slots including the given rack mount slot. The slot-mountable rack mount module includes: a vessel containing at least one material. The at least one material is configured to absorb heat from within the electronics rack mount based at least on at least one of (a) at least one phase change of at least one of the at least one material or (b) at least one endothermic reaction of one or more of the at least one material.