Slot Valve Sensor Layout for On-the-Fly Substrate Centering
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Solution Overview
Problem
Conventional substrate processing systems face challenges in accurately centering and aligning circular substrates during transportation due to limited motion, leading to eccentricity and misalignment, which requires larger chamber volumes to accommodate aligners and sensors for correction.
Innovation Solution
Integration of on-the-fly substrate centering/alignment system using slot or isolation valves with sensors mounted on the valve doors to detect substrates, allowing for precise alignment without increasing the internal chamber volume.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If stationary aligners or sensors are placed within the chamber or on the end effector to correct substrate eccentricity, then substrate alignment precision is improved, but the internal volume of the chamber increases to accommodate these components
Solution Approach 1:
The patent replaces mechanical alignment systems (stationary aligners, sensors mounted on end effector) with an optical measurement system. Optical sensors detect substrate position through the chamber wall without requiring physical components inside the chamber, thus maintaining alignment precision while avoiding volume increase.
Solution Approach 2:
The patent moves the sensing function from the three-dimensional space inside the chamber to the two-dimensional plane of the chamber wall. By mounting sensors on the external surface of the chamber wall, the system eliminates the need for internal mounting space while maintaining measurement capability.
2Manufacturing precision
If the chamber volume is increased to accommodate aligners and sensors, then substrate alignment capability is improved, but the complexity of the apparatus increases
Solution Approach 1:
The chamber wall serves multiple functions: it acts as both the containment boundary and the mounting surface for sensors. This multi-functionality eliminates the need for separate sensor housings or internal mounting structures, thereby reducing apparatus complexity while maintaining alignment capability.
3Manufacturing precision
If conventional alignment methods are used with larger chamber volumes, then substrate centering is achieved, but processing efficiency decreases due to larger equipment footprint
Solution Approach 1:
The patent replaces bulk mechanical alignment structures with compact optical sensing elements that can be mounted on the chamber exterior. This substitution maintains substrate centering accuracy while significantly reducing the equipment footprint and improving processing efficiency.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables accurate substrate alignment while maintaining a compact chamber size, improving processing efficiency and reducing the need for larger internal volumes.
Implementation Method 1
at least one sensor element capable of sensing a substrate passing through the slot valve
Data Source
AI summary
A substrate processing apparatus including a frame defining a chamber with a substrate transport opening and a substrate transfer plane defined therein, a valve mounted to the frame and being configured to seal an atmosphere of the chamber when closed, the valve having a door movably disposed to open and close the substrate transport opening, and at least one substrate sensor element disposed on a side of the door and oriented to sense substrates located on the substrate transfer plane.