Slotted Antenna Module for Millimeter Wave Signal Loss Reduction
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Solution Overview
Problem
Existing antenna modules in high-frequency bands face challenges with signal loss, heat dissipation, and defect detection due to complex routing and material limitations, particularly in millimeter wave bands, where the number of antennas and integrated circuits increases, making it difficult to achieve high gain, radiation efficiency, and scalability while maintaining low signal loss and mechanical rigidity.
Innovation Solution
The proposed antenna module incorporates a slotted antenna with a package substrate where RFICs are disposed, eliminating the need for bump bonding by having the slot and signal connection parts face each other, allowing for separate manufacturing and inspection of antenna and substrate characteristics, and incorporating heat dissipation features to improve efficiency and reduce defects.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Power
If the number of antenna elements and RFICs is increased to achieve high output power and beamforming function in millimeter wave band, then the wireless communication performance is improved, but the device complexity and routing complexity increase significantly
Solution Approach 1:
The patent transitions from planar routing to three-dimensional routing by utilizing vertical vias through substrate layers. This allows signal paths to extend in the Z-direction (thickness direction), enabling complex interconnections between antenna elements and RFICs without increasing lateral routing complexity on the substrate surface.
Solution Approach 2:
The patent implements a multi-layer substrate structure where signal transmission lines are embedded within internal layers, nested between ground layers and dielectric materials. This nesting approach allows multiple signal paths to be contained within the substrate thickness, reducing surface clutter and simplifying external routing.
2Area of stationary object
If antenna elements are arranged closely to maintain compact size, then the device area is reduced, but mutual signal interference increases
Solution Approach 1:
The patent introduces ground layers as intermediary structures positioned between adjacent antenna elements. These ground layers act as electromagnetic shields, blocking mutual interference signals while allowing the antenna elements to be placed closer together. The ground layers are connected to reference potential, creating electromagnetic barriers that prevent signal coupling between adjacent elements.
Solution Approach 2:
The patent applies different material properties and structural characteristics to different regions of the substrate. Specifically, ground layers are strategically positioned in areas where signal interference is most likely to occur, while signal transmission lines are routed through regions optimized for electromagnetic propagation. This localized optimization allows compact antenna spacing while maintaining signal integrity.
3Adaptability or versatility
If multiple substrate layers are used to accommodate complex routing and antenna structures, then the functionality is improved, but heat dissipation becomes difficult
Solution Approach 1:
The patent extracts the heat dissipation function from the signal transmission path by separating RFIC mounting areas from antenna element areas. RFICs are mounted on specific substrate regions with direct thermal coupling to heat dissipation structures, while antenna elements are positioned on separate layers. This extraction allows independent optimization of thermal management without compromising antenna performance.
Solution Approach 2:
The patent utilizes the thickness direction (Z-axis) for thermal management by implementing heat dissipation structures that extend vertically through multiple substrate layers. Thermal vias and heat sinks are positioned to conduct heat away from RFIC mounting areas in the vertical dimension, preventing heat accumulation while maintaining the multi-layer functional structure.
4Loss of energy
If the substrate material is optimized for low dielectric loss at ultra-high frequency, then the signal loss is reduced, but the mechanical rigidity decreases
Solution Approach 1:
The patent employs composite substrate construction using multiple dielectric layers with different material properties. Low-loss materials are used in layers where signal transmission is critical, while mechanically stronger materials are used in structural layers that provide support and rigidity. This composite approach allows the substrate to simultaneously achieve low signal loss and adequate mechanical strength.
Solution Approach 2:
The patent divides the substrate into functionally distinct layers, each optimized for its specific purpose. Signal transmission lines are routed through low-loss dielectric layers, while ground layers and structural support elements are positioned in layers using materials optimized for mechanical strength. This segmentation allows independent optimization of electrical and mechanical properties without compromise.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances signal transmission efficiency, reduces signal loss, improves heat dissipation, and allows for individual defect detection, resulting in higher gain, radiation efficiency, and manufacturing yield, while simplifying the manufacturing process and reducing material costs.
Implementation Method 1
a slotted antenna 100 in which one or more slots 110 are formed and arranged in an array form, and radio communication signals are transmitted and received through the slots 110
Implementation Method 2
a heat dissipation part 300 configured to dissipate heat of the antenna module
Data Source
AI summary
Proposed is an antenna module including a slotted antenna having a slot through which an electromagnetic wave passes, and a package substrate allowing radio frequency integrated circuits (RFICs) to be disposed thereon, the package substrate having a signal transmission line connected to each of the RFICs and configured to transmit and receive an electromagnetic wave, wherein the slotted antenna and the package substrate are separately made and then the slotted antenna is mounted on the package substrate.