Slotted Conductive Clip Layout for Molding Compound Adhesion
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Solution Overview
Problem
Prior semiconductor device packages experience delamination of molding compound from the substrate due to moisture and thermal cycling, leading to device failure.
Innovation Solution
A semiconductor device assembly with a slotted conductive clip is used, where the slot allows for improved molding compound flow and adhesion promoter application, reducing delamination risks.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a solid conductive clip is used to provide electrical connection and mechanical support, then the electrical conductivity and structural integrity are improved, but the molding compound delaminates from the substrate due to poor adhesion in the area under the clip
Solution Approach 1:
The conductive clip is segmented by introducing slots that divide the solid structure into separated regions. These slots allow adhesion promoter material to be applied to the substrate surface in areas that would otherwise be covered by the solid clip, enabling the molding compound to adhere properly and preventing delamination while maintaining the clip's electrical and mechanical functions
Solution Approach 2:
An adhesion promoter material is introduced as an intermediary substance between the molding compound and the substrate in the areas exposed by the slots. This mediator enhances the bonding interface, ensuring strong adhesion and preventing delamination caused by moisture and thermal cycling, while the slots provide the necessary access for applying this promoter material
2Reliability
If slots are added to the conductive clip to improve adhesion, then molding compound delamination is reduced, but the structural integrity and electrical conductivity may be compromised
Solution Approach 1:
The slots are strategically designed with specific dimensions and positions to provide local adhesion improvement only where needed. The slot width is limited to no more than 30% of the clip width and the slot area is limited to no more than 20% of the clip footprint area, ensuring that the structural integrity and electrical conductivity of the clip are maintained while still allowing sufficient access for adhesion promoter application
Data Source
AI summary
In a general aspect, a semiconductor device assembly includes a substrate, a semiconductor die coupled to the substrate, and a conductive clip coupled to the semiconductor die. The conductive clip is arranged along a longitudinal axis and a transverse axis. The conductive clip has a length along the longitudinal axis, a width along the transverse axis, and a slot defined therethrough. The slot has a length along the longitudinal axis that is greater than or equal to seventy percent of the length of the conductive clip along the longitudinal axis. The slot has a width along the transverse axis that is greater than or equal to thirty percent of the width of the conductive clip along the transverse axis.