Slotted Heat Dissipating Structure for Thin Film Resistors

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Solution Overview

Problem

Existing semiconductor structures face challenges in efficiently dissipating heat from thin film resistors while maintaining stability and preventing electrical shorts.

Innovation Solution

The implementation of a heat dissipating structure with a slotted top plate configuration and via connections that contact heat dissipating plates, separated by insulator material, to effectively dissipate heat and prevent electrical shorts.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If a heat dissipating structure is placed close to thin film resistors, then heat dissipation efficiency is improved, but electrical shorts may occur between the heat dissipating structure and resistor contacts

Engineering Contradiction:

Improveheat dissipation efficiencyVSAvoidelectrical short prevention

Core Design Contradiction:

TemperatureVSReliability

Solution Approach 1:

The heat dissipating plate is divided into multiple segments with slots between them, allowing the structure to maintain electrical isolation from resistor contacts while preserving thermal conduction pathways to the substrate

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

Insulator material is introduced as an intermediary substance between the heat dissipating plate and surrounding structures, enabling thermal coupling to the substrate while preventing electrical contact with conductive elements

Inventive Principle:

Principle #24Intermediary (Mediator)

2Reliability

If insulator material is used to separate heat dissipating structures, then electrical short prevention is improved, but thermal conduction efficiency deteriorates

Engineering Contradiction:

Improveelectrical short preventionVSAvoidthermal conduction efficiency

Core Design Contradiction:

ReliabilityVSTemperature

Solution Approach 1:

Insulator material is applied selectively only where electrical isolation is required (between heat dissipating plate and resistor contacts), while leaving thermal pathways to the substrate open for efficient heat conduction

Inventive Principle:

Principle #3Local quality

Solution Approach 2:

The heat dissipating plate is segmented into multiple sections with insulator material placed in the slots, creating localized electrical isolation zones that do not impede overall thermal conduction to the substrate

Inventive Principle:

Principle #1Segmentation

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This solution provides a more efficient thermal dissipation mechanism, stabilizes sheet resistance shifts in thin film resistors during high current operation, and eliminates the risk of electrical shorts.

Implementation Method 1

a heat dissipating structure below the thin film resistor comprising a top plate with a slotted configuration

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 2

a heat dissipating plate separated from the thin film resistor by insulator material

Methodology Applied

Scientific EffectElectrical insulation: Dielectric

Data Source

PatentUS12278029B2Heat dissipating structures

Publication Date: 2025.04.15 GLOBALFOUNDRIES SINGAPORE PTE LTD

AI summary

The present disclosure relates to semiconductor structures and, more particularly, to heat dissipating structures and methods of manufacture. The structure includes: a thin film resistor within a back end of the line structure; and a heat dissipating structure below the thin film resistor, the heat dissipating structure includes a top plate with a slotted configuration and being within the back end of the line structure.