Slotted Heat Spreader Structure for Stable, Space-Saving Mounting
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Solution Overview
Problem
Conventional heat spreaders for semiconductor devices occupy valuable space on substrates due to their foot and slope sidewall design, limiting the mounting space for both large semiconductor dies and smaller discrete components.
Innovation Solution
A heat spreader design featuring a main body with two foot supports extending downward, each with a slot on its inner surface, aligned to prevent substrate movement and minimize space occupation, allowing for efficient heat dissipation and increased component mounting capacity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a conventional heat spreader includes a foot portion and slope sidewall portion for attaching onto a substrate, then the heat spreader can be securely mounted, but the mounting space on the substrate is reduced
Solution Approach 1:
The patent extracts the attachment function from the traditional foot portion and slope sidewall structure, removing these space-consuming elements. Instead, it uses a simplified bottom surface with attachment features that achieve the same mounting stability without requiring the same amount of substrate space, thus resolving the contradiction between secure mounting and space utilization.
Solution Approach 2:
The patent transitions from a traditional three-dimensional foot portion extending outward from the substrate to a two-dimensional attachment scheme where the bottom surface lies substantially in the same plane as the substrate surface. This dimensional change eliminates the need for vertical space and reduces the footprint on the substrate while maintaining attachment reliability.
2Productivity
If more components are mounted on the substrate to increase component density, then the device functionality is enhanced, but the space for heat spreader mounting is further limited
Solution Approach 1:
By removing the foot portion and slope sidewall structures that traditionally occupied substrate space, the patent frees up area for additional components. This extraction allows the heat spreader to be mounted with a smaller footprint, enabling higher component density on the substrate without compromising heat spreader attachment.
Solution Approach 2:
The simplified bottom surface design with attachment features serves multiple functions: it provides secure mounting, maintains thermal contact with the substrate, and minimizes space occupation. This multi-functional design allows the heat spreader to achieve its goals while occupying minimal substrate area, thereby increasing overall component mounting capacity.
3Reliability
If the heat spreader uses a traditional foot portion design, then attachment is achieved, but the layout flexibility for semiconductor devices is reduced
Solution Approach 1:
The patent removes the traditional foot portion and slope sidewall structures that constrained layout flexibility. The resulting simplified bottom surface design maintains attachment capability while adapting to various substrate layouts and component arrangements, thereby improving layout flexibility without sacrificing attachment reliability.
Solution Approach 2:
Instead of having the heat spreader protrude outward from the substrate with foot portions, the patent inverts the approach by having the bottom surface lie substantially in the same plane as the substrate surface. This inversion allows for greater layout flexibility as the heat spreader can be positioned and oriented more freely on the substrate while maintaining secure attachment.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The new heat spreader design effectively transfers heat from semiconductor dies to the environment while optimizing substrate space, enabling the mounting of more components without obstructing the substrate's surface, thus enhancing thermal performance and component density.
Implementation Method 1
a heat spreader to transfer from the die to a surrounding environment
Data Source
AI summary
Provided is a heat spreader for use with a semiconductor device comprising a substrate and at least one semiconductor die mounted on the substrate. The heat spreader comprises: a main body defining a space for receiving the at least one semiconductor die; and two foot supports extending downward from the main body and opposite to each other, each of the foot supports defining a slot at its inner surface, wherein the slots of the two foot supports are aligned with each other. When the heat spreader is mounted with the semiconductor device, the slots prevent the substrate from moving closer to or away from the main body.