Direct-Cooled Power Module Package With Slotted Heat Sink Layout

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Solution Overview

Problem

Conventional power module packages are often large and inefficient in cooling multiple power modules, which can lead to thermal management challenges and increased size and complexity.

Innovation Solution

A power module package design that includes multiple power modules, heat sinks, and a module carrier with heat-sink slots, where the heat sinks extend through the slots and are coupled to the modules, allowing for direct cooling with a cooling fluid injected into a housing, and a ring member for sealing and alignment, enabling compact and efficient thermal management.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If conventional power module packages are used to meet cooling performance requirements, then cooling performance is improved, but package size increases

Engineering Contradiction:

Improvecooling performanceVSAvoidpackage size

Core Design Contradiction:

TemperatureVSVolume of stationary object

Solution Approach 1:

The patent merges multiple power modules into a single integrated package with a common cooling system. The module carrier integrates multiple power modules and heat sinks into one compact unit, allowing them to share cooling resources and reducing overall package size while maintaining effective thermal management.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The patent employs a nested structure where heat sinks are positioned within the module carrier housing, and power modules are mounted on the heat sinks. This nested arrangement maximizes space utilization and enables compact packaging while ensuring adequate cooling performance for all modules.

Inventive Principle:

Principle #7Nested doll (Nesting)

2Device complexity

If multiple power modules are integrated in a compact package, then device complexity is reduced, but thermal management becomes more challenging

Engineering Contradiction:

Improvepackage integrationVSAvoidthermal management

Core Design Contradiction:

Device complexityVSTemperature

Solution Approach 1:

The patent segments the thermal management system by providing individual heat sinks for each power module while integrating them into a common cooling architecture. This segmentation allows each module to be cooled independently through dedicated heat dissipation paths, simplifying thermal management in compact packages.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The module carrier serves multiple functions: it provides mechanical support for power modules, integrates heat sinks, facilitates cooling fluid distribution, and enables compact packaging. This multi-functionality reduces device complexity while maintaining effective thermal management.

Inventive Principle:

Principle #6Universality (Multi-functionality)

3Temperature

If direct cooling is implemented for multiple power modules, then cooling efficiency is improved, but manufacturing complexity increases

Engineering Contradiction:

Improvecooling efficiencyVSAvoidassembly complexity

Core Design Contradiction:

TemperatureVSEase of manufacture

Solution Approach 1:

The patent incorporates preliminary cooling channels and heat sink structures into the module carrier during manufacturing, before final assembly. This preliminary action simplifies subsequent assembly steps and enables direct cooling implementation without significantly increasing manufacturing complexity.

Inventive Principle:

Principle #10Preliminary action

Solution Approach 2:

The module carrier acts as an intermediary component that integrates power modules and heat sinks, facilitating direct cooling while simplifying assembly. The carrier provides pre-configured mounting interfaces and cooling fluid pathways, reducing manufacturing complexity despite the advanced cooling implementation.

Inventive Principle:

Principle #24Intermediary (Mediator)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The design achieves efficient direct cooling of multiple power modules, reducing heat generation and allowing for a compact, robust, and easily assembled power module package suitable for high-voltage applications, such as automotive inverters.

Implementation Method 1

heat sinks including a first heat sink coupled to the first power module and a second heat sink coupled to the second power module

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 2

direct cooling multiple power modules

Methodology Applied

Scientific EffectConvection: Convection

Data Source

PatentUS11848320B2Power module package for direct cooling multiple power modules

Publication Date: 2023.12.19 SEMICON COMPONENTS IND LLC

AI summary

According to an aspect, a power module package includes a plurality of power modules including a first power module and a second power module, a plurality of heat sinks including a first heat sink coupled to the first power module and a second heat sink coupled to the second power module, and a module carrier coupled to the plurality of power modules, where the module carrier includes a first region defining a first heat-sink slot and a second region defining a second heat-sink slot. The first heat sink extends at least partially through the first heat-sink slot and the second heat sink extends at least partially through the second heat-sink slot. The power module package includes a housing coupled to the module carrier and a ring member located between the module carrier and the housing.