Slotted Substrate Support for Multi-Wafer Microwave Heating

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Solution Overview

Problem

Existing semiconductor manufacturing processes face inefficiencies in processing multiple substrates while maintaining optimal temperature control and minimizing dielectric and ohmic losses due to microwave irradiation.

Innovation Solution

A substrate processing apparatus with a support member structure that allows simultaneous processing of multiple substrates, incorporating a baffle to partition the processing chamber and exhaust spaces, and a heating unit to efficiently control temperature using microwaves, while preventing microwave leakage.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If multiple substrates are processed simultaneously in a single chamber, then manufacturing efficiency is improved, but temperature control becomes more difficult and microwave losses increase

Engineering Contradiction:

Improvemanufacturing efficiencyVSAvoidtemperature control

Core Design Contradiction:

ProductivityVSTemperature

Solution Approach 1:

The processing chamber is divided into multiple processing spaces by introducing support members with slots that can hold substrates at different positions. This segmentation allows independent temperature zones for each substrate while maintaining a single vacuum chamber, resolving the contradiction between processing multiple substrates and maintaining temperature control.

Inventive Principle:

Principle #1Segmentation

2Productivity

If multiple substrates are processed simultaneously, then manufacturing efficiency is improved, but dielectric and ohmic losses from microwave irradiation increase

Engineering Contradiction:

Improvemanufacturing efficiencyVSAvoidmicrowave losses

Core Design Contradiction:

ProductivityVSLoss of energy

Solution Approach 1:

The support members are designed with slots that selectively position substrates in regions with optimized microwave field distribution. By creating local variations in substrate positioning, the system maximizes microwave heating efficiency for each substrate while minimizing overall energy losses in the chamber.

Inventive Principle:

Principle #3Local quality

3Productivity

If support members are added to hold multiple substrates, then simultaneous processing is enabled, but device complexity increases

Engineering Contradiction:

Improvesimultaneous processing capabilityVSAvoidsupport member structure

Core Design Contradiction:

ProductivityVSDevice complexity

Solution Approach 1:

The support members serve multiple functions: they hold substrates in precise positions, define processing spaces, and act as microwave-transparent structures. This multi-functionality reduces the need for separate components, thereby managing device complexity while enabling simultaneous processing of multiple substrates.

Inventive Principle:

Principle #6Universality (Multi-functionality)

4Power

If microwaves are used for heating multiple substrates, then heating efficiency is improved, but microwave leakage and energy loss increase

Engineering Contradiction:

Improveheating efficiencyVSAvoidmicrowave leakage

Core Design Contradiction:

PowerVSLoss of energy

Solution Approach 1:

The support members act as intermediary structures that are transparent to microwaves, allowing microwave energy to pass through and heat substrates positioned on them. This intermediary design enables efficient microwave heating while preventing energy loss through strategic material selection and structural design.

Inventive Principle:

Principle #24Intermediary (Mediator)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Enhances manufacturing efficiency by allowing simultaneous processing of multiple substrates with improved temperature control and reduced microwave losses, maintaining a vacuum state and enhancing heating efficiency.

Implementation Method 1

dielectric loss and ohmic loss are generated as the electric and magnetic fields formed by the microwaves pass through the material, generating thermal energy within the processing chamber

Methodology Applied

Scientific EffectDielectric loss: Dielectric Heating

Implementation Method 2

dielectric loss and ohmic loss are generated as the electric and magnetic fields formed by the microwaves pass through the material, generating thermal energy within the processing chamber

Methodology Applied

Scientific EffectOhmic loss: Joule Heating

Implementation Method 3

a baffle disposed around the pedestal to partition the process chamber into a processing space and an exhaust space

Methodology Applied

Scientific EffectPhysical containment: Physical Containment

Data Source

PatentUS20260035796A1Substrate processing apparatus including a support member

Publication Date: 2026.02.05 SAMSUNG ELECTRONICS CO LTD

AI summary

A substrate processing apparatus including a process chamber, a substrate support disposed inside the process chamber, a heating unit configured to supply heat into the process chamber, and a plurality of support members detachably coupled to the substrate support. Each of the plurality of support members includes a body part extending in a first direction substantially perpendicular to an upper surface of the substrate support, and a plurality of support slots formed in the body part, each of the plurality of support slots configured to receive an insertion of a substrate, and to support the substrate and position the substrate with its length substantially in parallel to the upper surface of the substrate support.