Slow-Wave Microstrip Line With Alternating Width And Thickness

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Solution Overview

Problem

Current microstrip line structures in integrated circuits are limited in reducing the size and cost of passive components, particularly in microwave and millimeter-wave integrated circuits, due to high losses and inefficient use of board area, necessitating the development of advanced interconnects that promote slow-wave propagation.

Innovation Solution

The implementation of a slow-wave microstrip line structure with a signal layer having alternating wide and narrow portions of different thicknesses and heights, allowing for adjustable capacitance and inductance tuning by varying the thickness and spacing of these portions, and the incorporation of a cross-under metal layer to enhance capacitance, enabling compact and efficient design.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Area of stationary object

If conventional microstrip line structures are used, then the design and manufacturing are simple, but the passive components occupy large board area and have high losses

Engineering Contradiction:
Improveboard area occupied by passive componentsVSAvoidmicrostrip line structure complexity
Core Design Contradiction:
Area of stationary objectVSDevice complexity

Solution Approach 1:

The signal layer is segmented into alternating wide and narrow portions along its length, creating a non-uniform microstrip line structure. This segmentation allows different sections to contribute differently to the overall electrical characteristics, enabling slow-wave propagation while maintaining manufacturability through standard fabrication processes.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

Different portions of the signal layer are given different local qualities through varying width and thickness. The wide portions provide higher capacitance while the narrow portions provide higher inductance, creating a distributed structure that achieves slow-wave effects without requiring complex external components.

Inventive Principle:
Principle #3Local quality

2Area of stationary object

If discrete passive components are used, then the circuit functionality is achieved, but 80% of the transceiver board area is occupied

Engineering Contradiction:
Improvetransceiver board areaVSAvoidintegration density
Core Design Contradiction:
Area of stationary objectVSProductivity

Solution Approach 1:

The microstrip line structure merges multiple functions into a single interconnect element. It simultaneously serves as a transmission line, a delay line, and a frequency-selective structure, eliminating the need for separate discrete passive components and significantly reducing board area while increasing integration density.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The non-uniform microstrip line structure provides multi-functionality by achieving slow-wave propagation, impedance transformation, and frequency selection all within the same interconnect structure, making it a universal solution for various RF circuit requirements.

Inventive Principle:
Principle #6Universality (Multi-functionality)

3Area of stationary object

If on-chip passive components are integrated, then the space is reduced, but high losses occur in transmission lines and antennas

Engineering Contradiction:
Improvechip area for passive componentsVSAvoidtransmission line losses
Core Design Contradiction:
Area of stationary objectVSLoss of energy

Solution Approach 1:

The microstrip line structure introduces dynamic electrical characteristics through its non-uniform geometry. The alternating wide and narrow portions create varying capacitance and inductance values along the line, enabling slow-wave propagation that reduces the electrical length and consequently reduces transmission losses without increasing physical chip area.

Inventive Principle:
Principle #15Dynamics

4Length of moving object

If slow-wave propagation is achieved through conventional structures, then the component size is reduced, but the characteristic impedance control is limited

Engineering Contradiction:
Improveeffective electrical length of transmission lineVSAvoidcharacteristic impedance tuning range
Core Design Contradiction:
Length of moving objectVSAdaptability or versatility

Solution Approach 1:

The structure enables independent control of multiple parameters including width, thickness, and spacing of the signal layer portions. By varying these geometric parameters, the characteristic impedance and slow-wave factor can be independently tuned to achieve optimal performance for different frequency ranges and circuit requirements.

Inventive Principle:
Principle #35Parameter changes

Data Source

PatentUS8766748B2Microstrip line structures with alternating wide and narrow portions having different thicknesses relative to ground, method of manufacture and design structures
Publication Date: 2014.07.01 INTERNATIONAL BUSINESS MACHINE CORPORATION
  • US8766748B2 patent drawing
  • US8766748B2 patent drawing
  • US8766748B2 patent drawing

AI summary

On-chip high performance slow-wave microstrip line structures, methods of manufacture and design structures for integrated circuits are provided herein. The structure includes at least one ground and a signal layer provided in a different plane than the at least one ground. The signal layer has at least one alternating wide portion and narrow portion with an alternating thickness such that a height of the wide portion is different than a height of the narrow portion with respect to the at least one ground.