Shape Memory Alloy Downhole Device Deployment

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Solution Overview

Problem

Current shape memory devices used in wellbores, such as packers and sand screens, face challenges with polymer materials that require cumbersome high-temperature molding, have lower operating temperatures, and lower mechanical strength, as well as slow expansion due to low thermal conductivity.

Innovation Solution

The use of shape memory alloys (SMAs) that can be compressed to a smaller shape for deployment and then heated to their original, expanded shape using electrical energy, heat sources, or hot fluids, allowing for efficient deployment in high-temperature wellbores with higher mechanical strength.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If polymer shape memory materials are used for downhole devices, then the devices can be formed with shape memory properties, but the operating temperature is limited and mechanical strength is reduced

Engineering Contradiction:
Improveoperating temperatureVSAvoidmechanical strength
Core Design Contradiction:
TemperatureVSStrength

Solution Approach 1:

The patent changes the material parameter from polymer to shape memory alloy, which fundamentally alters the temperature range and mechanical properties. The SMA maintains shape memory functionality while operating at temperatures exceeding 300°F and providing superior mechanical strength compared to polymer materials.

Inventive Principle:
Principle #35Parameter changes

Solution Approach 2:

The patent employs shape memory alloy materials that combine the shape memory effect with high-temperature resistance and high mechanical strength. The SMA acts as a composite solution integrating multiple desirable properties that were previously mutually exclusive in single-material systems.

Inventive Principle:
Principle #40Composite materials

2Speed

If polymer shape memory materials are used for downhole devices, then the devices can be deployed in wellbores, but the expansion time is prolonged due to low thermal conductivity

Engineering Contradiction:
Improveexpansion speedVSAvoidthermal conductivity
Core Design Contradiction:
SpeedVSLoss of energy

Solution Approach 1:

The patent changes the thermal conductivity parameter by switching from polymer to shape memory alloy material. The SMA's higher thermal conductivity enables faster heat transfer throughout the device, resulting in quicker expansion from the compressed delivery configuration to the expanded functional configuration.

Inventive Principle:
Principle #35Parameter changes

3Ease of manufacture

If polymer shape memory materials are used for downhole devices, then the devices can be manufactured with shape memory properties, but the manufacturing process becomes cumbersome requiring controlled heat chambers

Engineering Contradiction:
Improvemanufacturing complexityVSAvoidmanufacturing facility complexity
Core Design Contradiction:
Ease of manufactureVSDevice complexity

Solution Approach 1:

The patent changes the material processing parameters by using shape memory alloys instead of polymers. The SMA can be formed at ambient or lower temperatures using conventional metallurgical processes, eliminating the need for specialized high-temperature polymer molding chambers and complex controlled environment facilities.

Inventive Principle:
Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

SMAs enable reliable and efficient deployment of devices in high-temperature wellbores with higher mechanical strength, operating at temperatures above those of polymer-based devices, and faster expansion, enhancing the reliability and efficiency of wellbore operations.

Implementation Method 1

Shape memory materials or swellable materials that contain non-metallic materials, such as polymers, have been utilized for making shape conformable devices and members. A polymer shape memory material has a glass transition temperature and when such a material is heated to or above such temperature, it expands.

Methodology Applied
Scientific EffectShape memory effect: Shape Memory Alloy

Implementation Method 2

a device for supplying electrical energy to the shape memory alloy downhole to transform the shape memory alloy from the compressed shape to or near the expanded shape

Methodology Applied
Scientific EffectJoule heating: Joule Heating

Data Source

PatentUS9777548B2Conformable devices using shape memory alloys for downhole applications
Publication Date: 2017.10.03 BAKER HUGHES CO
  • US9777548B2 patent drawing
  • US9777548B2 patent drawing
  • US9777548B2 patent drawing

AI summary

An apparatus for use in wellbore includes a device having a shape conforming member that includes a shape memory alloy that has been compressed from a first expanded shape to a second compressed shape. The apparatus further includes a device for supplying electrical energy to the shape memory alloy downhole to transform the shape memory alloy from the second shape to or near the first shape.