Shape Memory Alloy Module Drive for Image Sensor Thermal Management

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Solution Overview

Problem

Conventional imaging units with movable heat sinks require significant electric power to operate the electromagnetic drive mechanism, leading to inefficient heat dissipation from the image sensor.

Innovation Solution

A module drive device incorporating a movable-side member with a module holder for an optical module, a fixed-side member for a heat dissipation member, and a driver using shape-memory alloy wires to move the movable-side member. A biasing unit, comprising a magnet and a magnetic member, biases the module holder to ensure contact between the substrate member and the heat dissipation member when the shape-memory alloy wire is not energized.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If an electromagnetic drive mechanism is used to move the heat sink, then the heat dissipation function can be achieved, but the power consumption increases significantly

Engineering Contradiction:

Improveheat dissipation efficiencyVSAvoidpower consumption

Core Design Contradiction:

TemperatureVSUse of energy by moving object

Solution Approach 1:

The patent replaces the electromagnetic drive mechanism with a shape-memory alloy wire-based driving system. The shape-memory alloy wires utilize thermal expansion and phase transition effects to move the movable-side member, eliminating the need for electromagnetic actuators and significantly reducing power consumption while maintaining heat dissipation functionality.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

Solution Approach 2:

The heat dissipation system utilizes the heat generated by the image sensor itself to drive the shape-memory alloy wires, which then position the heat sink. The thermal energy that would otherwise be wasted is converted into mechanical work for positioning, creating a self-service system that requires minimal external power input.

Inventive Principle:

Principle #25Self-service

2Temperature

If a separate drive mechanism is provided for the heat dissipation member, then the heat sink can be positioned accurately, but the device complexity increases

Engineering Contradiction:

Improveheat dissipation controlVSAvoidstructure complexity

Core Design Contradiction:

TemperatureVSDevice complexity

Solution Approach 1:

The patent combines the heat dissipation function and the positioning function into a single integrated system. The shape-memory alloy wires serve dual purposes: they position the movable-side member and simultaneously control the heat sink positioning, eliminating the need for separate drive mechanisms and reducing overall device complexity.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The shape-memory alloy wire system performs multiple functions: it acts as both the driving mechanism for the movable-side member and the positioning mechanism for the heat sink. This multi-functional design reduces the number of components needed and simplifies the overall device structure while maintaining effective heat dissipation control.

Inventive Principle:

Principle #6Universality (Multi-functionality)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration enables efficient heat dissipation from the image sensor without the need for a separate drive mechanism for the heat dissipation member, reducing power consumption and allowing for enhanced heat dissipation capabilities.

Implementation Method 1

a driver that moves the movable-side member with respect to the fixed-side member by utilizing a plurality of shape-memory alloy wires provided between the fixed-side member and the movable-side member

Methodology Applied

Scientific EffectShape memory alloy: Shape Memory Alloy

Implementation Method 2

a fixed-side member mounted so as not to be movable relative to a heat dissipation member that dissipates heat generated by the image sensor

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentUS20250147266A1Module drive device

Publication Date: 2025.05.08 ALPS ALPINE CO LTD

AI summary

A module drive device that includes: a movable-side member that includes a module holder configured to hold an optical module that includes a lens body, a substrate member, and an image sensor that is mounted on an upper surface of the substrate member so as to face the lens body in an optical axis direction; a fixed-side member mounted so as not to be movable relative to a heat dissipation member that dissipates heat generated by the image sensor; a driver that moves the movable-side member with respect to the fixed-side member by utilizing a plurality of shape-memory alloy wires provided between the fixed-side member and the movable-side member; and a biasing unit for biasing the module holder to a side of the heat dissipation member that faces a lower surface of the substrate member.