SMA OIS Motor Drive Structure With Pre-Molded Conductive Base
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Solution Overview
Problem
Existing OIS motor drive structures, particularly those using shape memory alloy (SMA) components, have complex configurations with numerous parts that require adhesive fixing, leading to low manufacturing efficiency and reduced qualification rates.
Innovation Solution
A simplified drive structure for OIS motors incorporating a base made of insulating material with a pre-molded conductive layer, SMA wires, crimpers, and a spring, where the conductive layer is integrated into the base and SMA wires are uniformly distributed, reducing the number of parts and assembly steps, and eliminating the need for adhesive dispensing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a separate metal base, insulating layer, and conductive layer are used in the SMA OIS drive structure, then electrical insulation and conductivity are achieved, but the number of parts increases and manufacturing complexity increases
Solution Approach 1:
The patent combines the base, insulating layer, and conductive layer into an integrated structure where the conductive layer is pre-molded directly onto the base surface. This merging eliminates the need for separate insulating layers and reduces the total number of components while maintaining the required electrical insulation and conductivity functions.
Solution Approach 2:
The conductive layer is pre-molded onto the base surface during the base manufacturing process itself, rather than being assembled as a separate component. This preliminary action integrates multiple functions into a single manufacturing step, reducing subsequent assembly complexity and part count.
2Ease of manufacture
If multiple separate parts are used in the drive structure, then functional requirements are met, but adhesive fixing is required which reduces manufacturing efficiency and qualification rate
Solution Approach 1:
By integrating the conductive layer and base into a single pre-molded component, the patent eliminates multiple adhesive bonding operations that would be required to assemble separate parts. This merging directly improves manufacturing efficiency by reducing both the number of assembly steps and the risk of assembly defects.
3Device complexity
If the conductive layer is pre-molded in the base, then the number of parts is reduced and assembly is simplified, but electrical connection reliability must be maintained
Solution Approach 1:
The conductive layer is pre-molded onto the base surface during the base manufacturing process, creating a permanent integral connection. This preliminary action ensures reliable electrical connections are built into the structure itself, eliminating the need for separate connection components while maintaining connection reliability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration reduces processing costs, simplifies assembly, and enhances manufacturing efficiency by minimizing parts and eliminating adhesive fixing, while ensuring stable electrical connections and smooth movement of components.
Implementation Method 1
The drive structure for the existing SMA OIS consists of a separate metal base (1), an insulating layer (sub base/spacer), a conductive layer (LCP), a crimper, a spring, a friction plate (bearing) and SMA wires
Implementation Method 2
The stabilization mechanisms of the existing OIS motors mainly include a split translation type, a tilt-shift type, a shape memory alloy (SMA) type
Data Source
AI summary
Disclosed are a drive structure for an OIS motor, an OIS motor, and a camera device. The key points of technical solutions are: a drive structure for an OIS motor includes a base, a conductive layer, a spring, and four SMA wires, the base is made of an insulating material, the conductive layer is disposed in the base, and terminals of the conductive layer protrude from the surface of the base; the base is provided with two first crimpers electrically connected to the conductive layer and disposed opposite to each other, the spring is provided with two second crimpers disposed opposite to each other, the four SMA wires are uniformly distributed on four sides of the base, and two ends of the SMA wires are respectively connected to the corresponding first crimpers and second crimpers.