Thermoresponsive Smart Adhesive Pad for Semiconductor Transfer
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Solution Overview
Problem
Existing adhesive pads have low adhesive strength and adhesion switching ratio, requiring high pre-load for attachment and detachment, which limits their industrial applications, particularly in the semiconductor industry where minimal pre-load and high adhesion switching are necessary for nanostructure transfer.
Innovation Solution
A thermoresponsive smart adhesive pad featuring a polymer layer with concave grooves, a hydrophilic surface layer, and a thermoresponsive hydrogel coating layer that changes volume with temperature, mimicking the adhesion mechanism of octopus suckers to achieve high adhesive strength and switching ratio without requiring high pre-load.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If a conventional hot melt adhesive pad is used, then the adhesive pad can be manufactured with simple structure, but the adhesive strength is low and high pre-load is required for attachment
Solution Approach 1:
The adhesive pad is segmented into multiple functional layers: a polymer layer with micropatterned concave grooves, a hydrophilic surface layer, and a thermoresponsive hydrogel coating layer. This segmentation allows each layer to perform specific functions that collectively enhance adhesive strength while enabling smart response to temperature changes.
Solution Approach 2:
The adhesive pad employs composite materials including a polymer base material (such as PDMS), a hydrophilic surface layer, and a thermoresponsive hydrogel coating. This composite structure combines the mechanical properties of the polymer with the surface activity of the hydrophilic layer and the thermoresponsive adhesion control of the hydrogel, achieving high adhesive strength and switchability.
2Strength
If high pre-load is applied to increase adhesive strength, then the adhesive strength improves, but the adhesion switching ratio decreases and removal becomes difficult
Solution Approach 1:
The adhesive pad incorporates a thermoresponsive hydrogel coating layer that dynamically changes its adhesion properties in response to temperature variations. At lower temperatures, the hydrogel exhibits high adhesion; at higher temperatures (above its lower critical solution temperature), it becomes hydrophobic and releases adhesion. This dynamic response enables high adhesion strength during attachment while facilitating easy removal without requiring high pre-load, achieving a high adhesion switching ratio.
Solution Approach 2:
The adhesive properties of the pad are controlled by changing the temperature parameter. The thermoresponsive hydrogel coating layer undergoes a phase transition at its lower critical solution temperature, changing from a hydrophilic adhesive state to a hydrophobic non-adhesive state. This parameter-based control allows the adhesive strength to be switched on demand without mechanical force, resolving the contradiction between strong adhesion and easy removal.
3Ease of manufacture
If conventional adhesive materials are used, then the manufacturing process is simple, but the adhesion switching ratio is low and on-demand adhesion change is not possible
Solution Approach 1:
The thermoresponsive hydrogel coating layer utilizes phase transition phenomena, specifically the lower critical solution temperature (LCST) transition. Below the LCST, the hydrogel is hydrophilic and adhesive; above the LCST, it becomes hydrophobic and releases adhesion. This phase transition mechanism enables on-demand adhesion switching while maintaining compatibility with conventional manufacturing processes such as spin-coating and UV curing.
Solution Approach 2:
The patent replaces mechanical control of adhesion (applying or removing pre-load) with thermal control. By using the thermoresponsive hydrogel's temperature-dependent adhesion properties, the system substitutes mechanical manipulation with thermal stimulation, enabling non-contact, on-demand adhesion switching that enhances adaptability while maintaining manufacturing simplicity.
4Force
If the adhesive pad requires high pre-load for attachment, then initial adhesion can be achieved, but the application range is limited and practical industrial use is restricted
Solution Approach 1:
The thermoresponsive hydrogel coating layer provides self-adjusting adhesion control based on temperature conditions. During attachment at lower temperatures, the hydrogel naturally exhibits high adhesion without requiring external pre-load. During removal or repositioning, heating above the LCST automatically reduces adhesion, enabling easy detachment. This self-service mechanism eliminates the need for high pre-load and expands the adhesive pad's applicability to sensitive applications such as semiconductor manufacturing.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The thermoresponsive smart adhesive pad exhibits excellent adhesion performance and adjustable adhesion capability based on temperature, enabling efficient semiconductor transfer printing technologies with reduced pre-load requirements and enhanced durability.
Implementation Method 1
a coating layer including a hydrogel and formed on the hydrophilic surface layer... The hydrogel may change a space volume in each of the concave grooves based on a temperature
Implementation Method 2
The hydrophilic surface layer may be formed by performing an O2 plasma treatment or ultraviolet (UV)/ozone treatment of a surface of the polymer layer
Implementation Method 3
The hydrophilic surface layer may be formed by performing an O2 plasma treatment or ultraviolet (UV)/ozone treatment of a surface of the polymer layer
Data Source
AI summary
At least one example embodiment relates to a thermoresponsive smart adhesive pad. Provided is a thermoresponsive smart adhesive pad that includes a polymer layer including a plurality of concave grooves; a hydrophilic surface layer formed on the polymer layer; and a coating layer including a hydrogel and formed on the hydrophilic surface layer. Also, provided is a method of manufacturing a thermoresponsive smart adhesive pad, including forming a plurality of convex structures on a substrate; forming a plurality of concave grooves in a polymer layer using the substrate on which the plurality of convex structures are formed; forming a hydrophilic surface layer by performing a hydrophilic treatment of a surface of the polymer layer in which the plurality of concave grooves are formed; forming, on the hydrophilic surface layer, a coating layer including a mixed solution containing a hydrogel monomer; and irradiating ultraviolet (UV) rays to the coating layer.