Smart Card Apertures for Nested Device Stacking
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Solution Overview
Problem
The thickness of smart cards with embedded electronic circuitry limits the number that can be comfortably carried due to increased volume when stacked, as each card's thickness contributes significantly to the overall stack thickness.
Innovation Solution
The solution involves creating smart cards with apertures that allow devices from one card to protrude through the apertures of adjacent cards when stacked, reducing the overall thickness of the stack to a quarter of the sum of individual card thicknesses by optimizing card thickness and device placement.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If smart cards have embedded electronic circuitry with standard thickness, then the circuitry can function properly, but the stack thickness increases significantly limiting the number of cards that can be carried
Solution Approach 1:
The patent implements nesting by allowing devices from one card to protrude through apertures in adjacent cards when stacked. The cards are designed with apertures positioned to receive the protruding portions of devices from neighboring cards, creating a nested arrangement where multiple cards share the same spatial volume. This reduces the overall stack thickness to approximately one-quarter of the sum of individual card thicknesses, enabling significantly more cards to be carried in a compact pile.
2Volume of stationary object
If card thickness is reduced to fit more cards, then the stack volume decreases, but the structural integrity and rigidity of the stack may be compromised
Solution Approach 1:
The nested arrangement where devices protrude through apertures in adjacent cards creates interlocking structural elements. The protruding portions of devices from one card insert into apertures of neighboring cards, forming a interconnected framework that distributes mechanical loads throughout the stack. This nesting structure maintains stack rigidity while significantly reducing overall volume.
Solution Approach 2:
The patent creates a composite structure combining card materials with device components that protrude through apertures. The stack becomes a composite assembly where the rigidity of individual cards and the interlocking device portions work together to maintain structural integrity. This composite approach allows thin cards to be stacked while preserving overall stack strength through the combined structural elements.
Data Source
AI summary
The present invention discloses systems and methods for a smart card including: a first card having a device; and a second card having an aperture that is configured to allow a device to be inserted into an aperture when the second card is properly aligned with the first card, thereby allowing a device to protrude into an aperture. Optionally, the first card includes an aperture, and the second card includes a device, so that an aperture of the first card accommodates a device of the second card when the first card is properly aligned with the second card. Optionally, the apertures and the devices are configured to allow a stack of a plurality of the first and second cards to be densely packed Optionally, a card includes a magnetic stripe, an electronic circuit, and/or an embedded electrically-conductive wire for operationally connecting a device to a connector.