Mini Smart Card Bilayered Print Layer Deformation Control
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Solution Overview
Problem
Conventional smart card manufacturing processes face challenges in preventing deformation and curvature during high-temperature treatments, leading to thickness issues that prevent cards from being inserted into ATMs or card readers, as they need to be thicker than 0.84 mm to avoid deformation but cannot exceed this thickness.
Innovation Solution
The method involves using bilayered print layers that undergo heat-compression and printing treatments, followed by surface layer removal and application of transparent protective layers, resulting in a miniaturized smart card that meets the thickness requirement without deforming, achieved by optimizing the thickness of the circuit, print, and protective layers.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the thickness of the print layer is increased to prevent deformation and curvature during high-temperature treatment, then the print layer remains stable during printing, but the smart card becomes too thick to be inserted into ATMs or card readers
Solution Approach 1:
The patent divides the print layer into multiple sub-layers with different material compositions and thermal expansion coefficients. The lower layer has higher thermal stability while the upper layer provides printing functionality. This segmentation allows the card to remain thin (0.74mm) while preventing deformation during high-temperature treatment through the coordinated thermal behavior of the layered structure.
Solution Approach 2:
The patent employs composite material construction for the print layer, combining materials with different thermal properties. The bilayered structure uses a base material with low thermal expansion and a surface material optimized for printing, creating a composite that resists thermal deformation while maintaining thin profile and printability.
2Length of stationary object
If the thickness of the print layer is reduced to achieve miniaturization of the smart card, then the smart card meets the thickness requirement for ATM and card reader compatibility, but the print layer deforms and curves during high-temperature treatment
Solution Approach 1:
The patent segments the thin print layer into multiple functional sub-layers, where each layer contributes specific properties. The lower sub-layer provides thermal stability and structural support, while the upper sub-layer enables printing functionality. This segmentation allows the overall thickness to be reduced to 0.74mm while maintaining dimensional stability during high-temperature processing.
Solution Approach 2:
The patent modifies the thermal parameters of the print layer materials and structure to accommodate thin-profile requirements. By selecting materials with appropriate thermal expansion coefficients and conducting heat-compression treatment at optimized temperatures and pressures, the patent achieves stable printing on thin layers without deformation.
3Manufacturing precision
If heat-compression treatment is applied to thin print layers before printing, then the print layers remain flat and stable during printing, but additional process steps are required
Solution Approach 1:
The patent combines the heat-compression treatment step with the printing process into an integrated operation. The heat-compression is applied in-situ during the printing process rather than as a separate pre-treatment step, thereby achieving flatness and stability of the thin print layer while avoiding additional manufacturing steps and maintaining process efficiency.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach ensures the smart card remains flat and functional, achieving miniaturization while preventing temperature-related deformation and meeting the necessary thickness for compatibility with ATMs and card readers, with a final thickness of 0.74 mm.
Implementation Method 1
performing a heat-compression treatment and then a printing treatment on the circuit layer, the bilayered print layers
Implementation Method 2
after undergoing the heat-compression treatment, the bilayered print layers can withstand the heat generated during the printing treatment and thus do not deform and curve
Data Source
AI summary
A mini smart card and a method of manufacturing the mini smart card are introduced. The method includes disposing bilayered print layers on a top side and a bottom side of a circuit layer, respectively; performing a heat-compression treatment and then a printing treatment on the circuit layer and the bilayered print layers; removing surface layers from the bilayered print layers; and disposing transparent protective layers on the bilayered print layers, respectively. The bilayered print layers are prevented from deforming under the heat generated during the printing treatment. Removal of the surface layers from the bilayered print layers effectively reduces the thickness of the mini smart card.