Smart Card Contact Pad Grid for Miniaturization
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Solution Overview
Problem
The miniaturization of smart cards is limited by the need to maintain compliance with existing standards while increasing functionality, which restricts the reduction of component sizes on the rear face of the modules, and existing solutions do not effectively reduce module dimensions while ensuring mechanical strength and compatibility with conventional card readers.
Innovation Solution
A smart card module with a carrier film featuring eight contact pads arranged in two parallel series of three pads each, with two additional pads located between them, allowing for a more compact form factor while adhering to the ISO 7816 standard dimensions and ensuring mechanical strength through a reinforcement zone and flip-chip assembly.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If the number of contact pads is increased beyond the standard eight to provide additional functions, then functionality is improved, but the module dimensions increase
Solution Approach 1:
The patent transitions from a conventional linear arrangement of contact pads to a two-dimensional grid pattern. The eight standard contact pads are arranged in a 2x4 grid, allowing additional contact pads to be integrated into the same spatial footprint by utilizing the grid structure. This dimensional reorganization enables increased functionality without proportionally increasing module area.
Solution Approach 2:
The patent merges the standard eight contact pads required by ISO 7816 with additional contact pads for extended functionality into a single integrated contact array. By combining these different functional requirements into one unified grid structure, the module achieves enhanced adaptability while maintaining compact dimensions, as the additional pads share the same physical space rather than requiring separate areas.
2Area of stationary object
If the contact pads are reduced in size to minimize module area, then module dimensions are reduced, but the surface area of contact pads decreases
Solution Approach 1:
The patent applies different dimensional characteristics to different regions of the contact pad array. While the overall module area is minimized through compact grid arrangement, each individual contact pad maintains adequate surface area by optimizing its local dimensions within the grid. This local optimization ensures that contact reliability is preserved even as the total module footprint is reduced.
3Adaptability or versatility
If additional contact pads are added between the standard series to increase functionality, then adaptability is improved, but device complexity increases
Solution Approach 1:
The patent creates a universal contact pad grid structure that can accommodate both the standard eight contact pads required by ISO 7816 and additional contact pads for extended functions. This multi-functional design allows the same physical structure to serve multiple purposes: compliance with standard specifications and support for additional features, thereby reducing the need for separate configuration systems and lowering overall device complexity.
Data Source
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Figure 2
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AI summary
A microcircuit module for a smart card includes a generally rectangular carrier film (101) provided with eight contact pads on a first face thereof and with an electronic component on a second face, the electronic component being equipped with connection terminals to which the contact pads are connected via the carrier film. The eight contact pads are disposed in two parallel series of three contact pads (C1, C2, C3, C5, C6, C7), with two other contact pads (C′4, C′8) being disposed therebetween and each being positioned close to the contact pads from the ends of each of the series. The contact pads each measure at least 1.7 mm×2 mm. The contact pads of the two parallel series comply with ISO standard 7816 and the eight contact pads border each of the sides of the carrier film.