Smart Card Antenna Chip Connection via Elastic Conductor
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Solution Overview
Problem
The existing production methods for dual interface smart cards are inefficient, with low yield and high rejection rates due to manual operations like tin welding, which can damage components and result in unstable electrical conductivity from conductive adhesives sensitive to time and environment.
Innovation Solution
A smart card with an antenna and chip module circuit layers connected through an elastic conductive device, eliminating the need for manual soldering and using a milling cutter with a sensor for precise groove milling, ensuring stable electrical connections and high-quality production.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If manual tin welding is used to connect antenna and chip module, then electrical connection can be achieved, but production efficiency is low and component damage risk increases
Solution Approach 1:
The patent replaces manual tin welding (mechanical operation) with conductive adhesive bonding (chemical/physical process). The conductive adhesive is applied automatically through dispensing equipment, eliminating manual soldering operations. This substitution maintains electrical connection reliability while dramatically improving production efficiency and reducing component damage from manual handling and hot welding processes.
Solution Approach 2:
The conductive adhesive performs multiple functions simultaneously: it provides mechanical bonding between components, establishes electrical conductivity pathways, and offers environmental protection. This self-service approach eliminates the need for separate welding and insulation steps, improving productivity while maintaining connection stability through the adhesive's inherent properties.
2Ease of manufacture
If manual tin welding and wire handling are used, then antenna and chip module can be connected, but product quality control becomes difficult and rejection rate increases
Solution Approach 1:
The patent replaces manual wire handling and welding operations with automated adhesive dispensing and positioning systems. This automation eliminates variability in manual operations, ensuring consistent adhesive application volume, position, and curing conditions. The result is improved manufacturing precision and reduced rejection rates while maintaining ease of manufacture through a simplified process flow.
Solution Approach 2:
The patent controls critical parameters such as adhesive application volume, positioning accuracy, and curing conditions through automated equipment. By precisely controlling these parameters, the process achieves consistent connection quality across all production batches, eliminating the quality variability inherent in manual operations while keeping the manufacturing process straightforward.
3Productivity
If conductive adhesive is used for bonding, then production efficiency improves, but electrical conductivity becomes unstable due to long curing time and environmental exposure
Solution Approach 1:
The patent optimizes adhesive formulation and curing parameters to reduce curing time and improve conductivity stability. By adjusting chemical composition, application thickness, and curing conditions (temperature, humidity control), the adhesive achieves rapid curing while maintaining stable electrical properties. This resolves the contradiction by making the adhesive process both efficient and reliable.
Solution Approach 2:
The patent uses specially formulated conductive adhesives that combine multiple functional properties: fast curing agents, stable conductive fillers, and protective encapsulants. This composite material approach allows the adhesive to cure quickly for high productivity while simultaneously providing stable, long-term electrical conductivity resistance to environmental factors.
4Ease of manufacture
If multiple manual operations are performed on antenna and chip module, then assembly can be completed, but component damage risk increases and stability of finished product decreases
Solution Approach 1:
The patent replaces multiple manual mechanical operations (wire picking, laying, bending, welding) with a single automated adhesive bonding process. This eliminates repeated handling and mechanical stress on delicate antenna wires and chip module leads, preventing damage while maintaining assembly feasibility through simplified, automated application of conductive adhesive.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach increases production efficiency, reduces component damage, and enhances product stability, meeting international standards for durability and performance.
Implementation Method 1
the antenna and the chip module circuit layer are electrically connected through an elastic conductive device
Implementation Method 2
using a milling cutter with a sensor for precise groove milling
Data Source
AI summary
A smart card with two read-write modes includes antenna layer, and an antenna and a chip module circuits on the antenna layer, wherein the antenna and the chip module circuit are electrically connected via an elastic conductive device. The invention also provides a manufacturing method of the aforesaid smart card with two read-write modes, which includes steps of: embedding an antenna on a back side or a front side of an antenna layer; after completing embedding on the antenna layer, add bedding sheets, printed sheets and protection films respectively above and underneath the antenna layer, then laminating to obtain a card base carrier; cutting card from the treated whole-sheet card base carrier to obtain a card base, and milling slots on the obtained card base, then finally encapsulating.