Smart Card Component Integration in Embossing Zones
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Solution Overview
Problem
The integration of electronic components in cards is limited by standardized dimensional specifications, such as those defined by the ISO 7810 and ISO 7811 standards, which restricts the size and layout of components that can be integrated, preventing the implementation of functionalities that could enhance user experience and causing compatibility issues with reading terminals.
Innovation Solution
The integration of electronic components in embossing regions defined by the ISO 7811-1 standard, allowing for a maximum thickness of 1.32 mm in these regions, while maintaining compliance with ISO 7810 and ISO 7811-1 standards, enabling the accommodation of more bulky components and ensuring normal operation with card readers.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If electronic components are integrated onto the circuit board to enhance functionality, then the card's functional capabilities are improved, but the card's thickness exceeds the ISO 7810 standard limit of 0.84mm
Solution Approach 1:
The patent utilizes the embossing regions defined in ISO 7811-1 as a third dimension for component placement. By positioning components within the embossed areas (zones 1 and 2) where the substrate already has increased thickness due to embossing, the invention effectively uses the vertical dimension created by embossing to accommodate component height without exceeding the overall card thickness limit.
Solution Approach 2:
The invention applies local quality by utilizing specific regions (embossing zones 1 and 2) of the substrate that have different thickness characteristics. These embossed regions locally increase the available space for mounting components, allowing the card to meet both thickness requirements and component integration needs in different areas of the same substrate.
2Adaptability or versatility
If larger electronic components are integrated to provide useful functionalities, then the card's functionality is enhanced, but compatibility with standard card readers is compromised
Solution Approach 1:
By utilizing the vertical space within embossed regions (a third dimension beyond the standard planar card surface), the invention accommodates larger component footprints and heights while maintaining the card's overall dimensional compliance with ISO 7810, thus preserving reader compatibility.
Solution Approach 2:
The invention takes preliminary action by utilizing pre-defined embossing regions (zones 1 and 2) that are already specified in the ISO 7811-1 standard. These regions are prepared in advance with increased thickness characteristics, allowing components to be mounted without requiring modifications to the card's overall dimensions or shape.
3Adaptability or versatility
If the card thickness is increased to accommodate bulky components, then component integration is enabled, but the card may cause reader damage or malfunction
Solution Approach 1:
The invention applies local quality by confining increased thickness to specific embossed regions (zones 1 and 2) rather than uniformly increasing the entire card thickness. This localized approach allows component accommodation while ensuring that the overall card dimensions remain within safe limits for reader interaction, preventing potential damage or malfunction.
Data Source
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AI summary
The invention relates to a card (C2; C3; C4; C5), said card comprising: - a substrate (10; 30) of ID-1 format according to ISO 7810; and - at least one electronic component (P1-P2; P3-P5; P6; P10) arranged on the substrate, all or part of said at least one electronic component being disposed in at least one of the two embossing regions (R1, R2) defined in ISO 7811-1 as regions in which embossed characters can be formed on the substrate; - an encapsulation of the assembly comprising the substrate (10; 30) and said at least one electronic component (P1-P2; P3-P5; P6; P10); such that the thickness of the card at said embossing regions does not exceed 1.32 mm.