Smart Card Fingerprint Module Packaging Structure
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Solution Overview
Problem
Current IC fingerprint chip cards integrate fingerprint identification modules and chips directly, leading to large chip sizes, increased manufacturing costs, and limited antistatic abilities due to restricted installation positions.
Innovation Solution
A capacitive-type fingerprint sensing identification module is independently packaged on a substrate, allowing separate packaging of the sensing module and chip on different printed circuit boards, using flexible and bendable dielectric materials to enhance antistatic capabilities and reduce costs, with a design that includes multiple layers and conductive posts for electrical connections and shielding.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If fingerprint identification module and chip are directly integrated and packaged together, then the structure is compact, but the chip size becomes too large and manufacturing cost increases
Solution Approach 1:
The patent divides the fingerprint identification system into separate modules: the fingerprint sensing module is packaged on one substrate while the fingerprint identification chip is packaged on another substrate. This segmentation allows each module to be optimized independently, reducing the overall chip size and manufacturing cost while maintaining compact integration through separate packaging.
2Volume of moving object
If fingerprint identification module and chip are directly integrated and packaged together, then the structure is compact, but the installation position is limited and antistatic ability decreases
Solution Approach 1:
By separating the fingerprint sensing module and identification chip into different packages, the patent enables independent optimization of installation positions. The sensing module can be positioned to maximize antistatic protection while the chip is positioned for optimal electrical connection, thereby improving overall system reliability without compromising compactness.
Solution Approach 2:
The patent introduces a flexible printed circuit board as an intermediary connection medium between the separately packaged sensing module and identification chip. This intermediary allows for flexible routing and positioning, enabling better antistatic protection while maintaining electrical connectivity.
3Stability of the object's composition
If rigid packaging material is used, then structural stability is good, but the card cannot be bent and flexibility is lost
Solution Approach 1:
The patent employs flexible printed circuit boards and flexible packaging substrates instead of rigid materials. These flexible components maintain sufficient structural stability for electrical connectivity and mechanical support while enabling the card to be bent without damage, thus achieving both stability and adaptability.
4Ease of manufacture
If separate packaging is adopted, then manufacturing cost is reduced and layout flexibility improves, but device complexity increases
Solution Approach 1:
The patent utilizes standard flexible printed circuit board technologies and conventional packaging processes for both the sensing module and identification chip. By employing universal manufacturing techniques rather than custom complex processes, the patent achieves cost reduction and layout flexibility while keeping the increase in device complexity manageable through standardized solutions.
Data Source
AI summary
A smart card fingerprint identification module packaging structure includes a first insulating layer, an insulating protective layer, a shielding layer, a second insulating layer, a fingerprint sensing area and bump pads. A first patterned circuit layer is embedded in the first insulating layer, and part of this layer serves as a first sensing circuit. A second patterned circuit layer is disposed on the second surface of the first insulating layer, and part of this layer serves as a second sensing circuit. A patterned metal layer is disposed on the second insulating layer and covers the outer surface of the second insulating layer as a shielding layer. The shielding layer corresponding to the first and the second sensing circuits is hollowed out to serve as a fingerprint sensing area. The longitudinal projections of the first sensing circuit and the second sensing circuit are staggered from each other without overlapping.