Smart Card With Synthetic-Hollowed Base Plate for Human-Computer Interaction
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing smart cards with contact or contactless chips face challenges in human-computer interaction and are difficult to manufacture effectively.
Innovation Solution
A smart card design featuring a synthetic-hollowed base plate with multiple layers and a mold insert containing interactive and non-interactive circuit modules, along with a covering layer made from materials like PVC, PC, PETG, and ABS PVC resin, to enhance human-computer interaction and manufacturing efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If traditional smart card structures with contact or contactless chips are used, then the card structure is simple, but the human-computer interaction ability is weak
Solution Approach 1:
The base plate is divided into multiple layers (first base plate, second base plate, third base plate) with different functions. The interactive circuit module is segmented into key module, display module, and other functional modules. This segmentation allows each component to be optimized independently while working together to provide comprehensive human-computer interaction capabilities.
Solution Approach 2:
The patent transitions from a traditional single-layer flat structure to a multi-layer three-dimensional structure. Different circuit modules are positioned at different heights and layers, with hollowed-out areas creating vertical stratification. This dimensional change enables better spatial arrangement of interactive components while maintaining overall card structure integrity.
2Productivity
If smart cards with human-computer interaction functions are manufactured using prior art methods, then the interaction function is achieved, but the manufacturing process is difficult and low efficiency
Solution Approach 1:
Hollowed-out areas are pre-formed in each base plate layer before assembly. Circuit modules are designed with predetermined positions and mounting structures. The key module, display module, and other modules are prepared in advance with specific mounting requirements. This preliminary preparation significantly simplifies the final assembly process and improves manufacturing efficiency.
Solution Approach 2:
The manufacturing process is segmented into independent steps for each layer and module. Each base plate can be processed separately, and circuit modules can be manufactured and tested independently before final assembly. This modular manufacturing approach enables parallel production and reduces overall manufacturing complexity.
Data Source
AI summary
A manufacturing method of a smart card. The manufacturing method comprises: respectively hollowing out a plurality of substrates to obtain a plurality of hollowed-out substrates (101); synthesizing the plurality of hollowed-out substrates to obtain a multilayer synthesized hollowed-out substrate (102); filling the synthesized hollowed-out substrate with an internal insert (103); and coating the synthesized hollowed-out substrate with adhesive to obtain the smart card (104). By adopting the technical solution that a multilayer synthesized hollowed-out substrate is obtained by synthesizing a plurality of hollowed-out substrates, and the synthesized hollowed-out substrate is filled with an internal insert, the production difficulty of the smart card with a function of human-computer interaction is reduced, and the production efficiency is increased.