Flexible Smart Card Circuits with Laser-Revealed Color Layers

The dielectric substrate is divided into multiple colored layers (first dielectric layer, second dielectric layer, third dielectric layer) with different colors (e.g., white, blue, yellow). Each layer is deposited separately and can be selectively removed or modified independently, enabling complex multicolored patterns to be created through systematic segmentation of the coloring process

The colored dielectric layers are deposited and patterned before the conductive traces are formed. This preliminary coloring allows the complex multicolored design to be established in advance, and subsequent manufacturing steps (such as laser etching to remove material) can reveal the predetermined color patterns without requiring complex operations during the final assembly

The patent utilizes multiple dielectric layers with different intrinsic colors (white, blue, yellow) to create security features. The colored layers are selectively positioned and revealed through controlled removal of other layers, enabling complex color patterns and security features without requiring additional complex manufacturing steps beyond standard multilayer deposition processes

Instead of using complex mechanical patterning systems to create color patterns, the patent employs selective chemical or physical removal (such as laser etching) of dielectric layers to reveal underlying colored layers. This substitution simplifies the manufacturing process by replacing complex mechanical coloring operations with a more straightforward selective removal approach