Smart Card IC Module Mesh Terminal for Low-Pressure Bonding
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Solution Overview
Problem
The antenna connection terminals in IC chip modules of smart cards have a large metal surface area, which reduces adhesive force, leading to potential peeling when the card is bent, and high pressure is required for bonding, causing deformation.
Innovation Solution
A smart card design with an IC chip module connected via a conductive adhesive containing blended conductive particles and a binder resin, where the antenna connection terminal has an opening wider than the average particle diameter, allowing improved flowability and adhesive force without high pressure.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If the antenna connection terminal uses a large metal surface area to improve connection area with the antenna coil, then the connection area is improved, but the adhesive force is reduced
Solution Approach 1:
The antenna connection terminal is designed with a mesh pattern, creating a porous structure that allows conductive adhesive to penetrate through the terminal. This increases the bonding surface area within the mesh openings while maintaining electrical conductivity through the metal pattern, thereby improving adhesive force without sacrificing connection area
Solution Approach 2:
The solution combines the metal antenna connection terminal with conductive adhesive material that fills the mesh openings. This composite structure allows the metal to provide electrical connection while the adhesive material provides bonding strength, resolving the contradiction between connection area and adhesive force
2Reliability
If high pressure is applied to embed the IC chip module to ensure proper bonding, then the bonding is improved, but the card becomes deformed
Solution Approach 1:
The mesh pattern in the antenna connection terminal creates porous spaces that allow conductive adhesive to flow through and penetrate during bonding. This enables the adhesive to distribute evenly and bond effectively at lower pressures, preventing card deformation while ensuring reliable bonding
Solution Approach 2:
The mesh structure changes the pressure distribution parameters during bonding, allowing pressure to be applied more uniformly through the adhesive material rather than concentrating force on solid metal surfaces. This reduces peak pressures needed for bonding, preventing card deformation
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enhances adhesive strength and prevents card deformation by improving the flowability of the conductive adhesive, ensuring secure bonding under lower pressure.
Implementation Method 1
the antenna coil and the antenna connection terminal are conductively connected via a conductive adhesive in which conductive particles are blended with binder resin
Implementation Method 2
the antenna connection terminal has an opening with a width larger than the average particle diameter of the conductive particles, allowing improved flowability and adhesive force without high pressure
Data Source
AI summary
Provided is a smart card that can improve the adhesive strength of the IC chip module even under low pressure, and can prevent deformation of the card by increasing the flowability of the conductive adhesive. The smart card includes a card body 2 with an antenna coil 3 built in, and an IC chip module 4 provided with an antenna connection terminal 5 for conductive connection with the antenna coil 3, the IC chip module 4 being housed in an accommodating recess 6 in the card body 2, wherein the antenna coil 3 and the antenna connection terminal 5 are conductively connected via a conductive adhesive 9 in which conductive particles 8 are blended with binder resin 7, and the antenna connection terminal 5 has an opening 10 with a width larger than the average particle diameter of the conductive particles 8.