Smart Card Module Embedding Without Cutouts

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Solution Overview

Problem

Conventional smart card module production methods require prefabricated cutouts in carrier layers, leading to complex and costly processes, and the embedded smart card modules can be damaged during lamination or pressing due to mechanical loading.

Innovation Solution

A method involving a smart card module with a substrate and a mechanical reinforcement structure, embedded between two carrier layers without prefabricated cutouts, where the carrier layers are laminated or pressed to enclose the module, increasing material density around it for stability and planar surface formation.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If prefabricated cutouts are made in carrier layers for receiving smart card modules, then the smart card modules can be received and embedded, but the production process becomes complex and costly

Engineering Contradiction:

Improvesmart card module embeddingVSAvoidproduction process

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

The invention removes the cutout feature from the carrier layer entirely. Instead of extracting material to create receptacles, the smart card module is embedded directly into the intact carrier layer through lamination, eliminating the complex cutout fabrication steps while maintaining reliable module reception

Inventive Principle:

Principle #2Taking out (Extraction)

Solution Approach 2:

Conventional approach creates cutouts first, then embeds modules. This invention inverts the sequence by embedding modules first into intact carrier layers, then laminating to secure them. This reversal eliminates the need for prefabricated cutouts and simplifies the overall production process

Inventive Principle:

Principle #13The other way round (Inversion)

2Reliability

If smart card modules are embedded in carrier layers with cutouts, then modules can be received, but modules can be damaged during lamination or pressing due to mechanical loading

Engineering Contradiction:

Improvemodule receptionVSAvoidmodule durability

Core Design Contradiction:

ReliabilityVSStrength

Solution Approach 1:

The invention applies a protective layer over the smart card module before lamination. This cushioning layer distributes mechanical stresses during pressing and lamination operations, preventing direct transmission of harmful forces to the module while ensuring reliable embedding in the carrier layer

Inventive Principle:

Principle #11Beforehand cushioning (Prior cushioning)

3Stability of the object's composition

If carrier layers are laminated or pressed to enclose smart card modules, then material density increases for stability and planar surface formation, but the process requires complex equipment and conditions

Engineering Contradiction:

Improvecard stabilityVSAvoidlamination process

Core Design Contradiction:

Stability of the object's compositionVSDevice complexity

Solution Approach 1:

The invention combines the lamination and embedding operations into a single integrated process step. The carrier layers are laminated together with the smart card module positioned between them, achieving both enclosure and density increase simultaneously without requiring separate embedding and lamination equipment

Inventive Principle:

Principle #5Merging (Combining)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach allows for cost-effective and efficient production of a mechanically stable smart card with a planar surface, where the smart card module is securely embedded without visible installation position, enhancing durability and reducing production complexity.

Implementation Method 1

at least one of laminating or pressing the first carrier layer with the second carrier layer, such that the smart card module is enclosed by the first carrier layer and the second carrier layer

Methodology Applied

Scientific EffectLamination: Lamination

Implementation Method 2

pressing the first carrier layer with the second carrier layer, such that the smart card module is enclosed by the first carrier layer and the second carrier layer

Methodology Applied

Scientific EffectCompression: Compression

Data Source

PatentUS10395157B2Smart card module arrangement, smart card, method for producing a smart card module arrangement and method for producing a smart card

Publication Date: 2019.08.27 INFINEON TECHNOLOGIES AG

AI summary

A method for producing a smart card module arrangement includes: arranging a smart card module on a first carrier layer, wherein the first carrier layer is free of a prefabricated smart card module receptacle cutout for receiving the smart card module. The smart card module includes: a substrate; a chip on the substrate; a first mechanical reinforcement structure between the chip and the substrate. The first mechanical reinforcement structure covers at least one part of a surface of the chip. The method further includes applying a second carrier layer to the smart card module, wherein the second carrier layer is free of a prefabricated smart card module receptacle cutout for receiving the smart card module; and at least one of laminating or pressing the first carrier layer with the second carrier layer, such that the smart card module is enclosed by the first carrier layer and the second carrier layer.