Smart Card Module Encapsulation for Chip Protection
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Solution Overview
Problem
Existing smart card modules require costly protection methods like molds or glob-tops to safeguard chips, which can be bulky and inefficient in terms of material usage and cost-effectiveness.
Innovation Solution
A smart card module package with a robust encapsulation and redistribution wiring that allows for a flip-chip arrangement, eliminating the need for molds or glob-tops while ensuring high quality and longevity, using a microchip and substrate with a contact zone according to ISO 7816 standards.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If molds or glob-tops are used to protect chips, then chip protection is improved, but material usage and cost increase
Solution Approach 1:
The invention extracts the protection function from traditional molds and glob-tops and integrates it into a specialized package structure. The package includes a substrate, encapsulation, and redistribution wiring that collectively provide chip protection without requiring separate mold or glob-top components, thereby reducing material usage while maintaining protection effectiveness.
Solution Approach 2:
The invention merges multiple functions into a single integrated package structure. The package combines chip mounting, electrical connection (via redistribution wiring), and protection functions into one unified structure, eliminating the need for separate protection components like molds or glob-tops and reducing overall material consumption.
2Reliability
If molds or glob-tops are used to protect chips, then chip protection is improved, but device complexity and cost increase
Solution Approach 1:
The package structure merges chip mounting, electrical connection, and protection functions into a single integrated unit. This consolidation reduces device complexity by eliminating separate mold or glob-top components while maintaining comprehensive chip protection through the integrated package design.
Solution Approach 2:
The package structure serves multiple functions simultaneously: it mounts the chip, provides electrical connections through redistribution wiring, and offers protection. This multi-functionality reduces the need for additional protective components, simplifying the overall device structure while maintaining robust chip protection.
3Reliability
If traditional protection methods are used, then chip safety is improved, but manufacturing cost increases
Solution Approach 1:
The invention combines protection functionality into the standard package structure, eliminating the need for separate mold or glob-top manufacturing steps. This integration reduces manufacturing complexity and cost while maintaining chip safety through the encapsulation and package design.
Solution Approach 2:
The package structure uses cost-effective materials and standard manufacturing processes to provide protection, replacing expensive specialized molds or glob-tops. The redistribution wiring and encapsulation are implemented using conventional, economical fabrication techniques that reduce overall manufacturing cost.
Data Source
AI summary
A smart card module for use in a smart card includes a microchip and a contact zone for making contact with the microchip by means of a reader. The microchip can be enclosed by an encapsulation which can enclose the microchip completely from all sides.