Smart Card IC Module Layout for Dual-Interface Isolation
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Solution Overview
Problem
Existing dual interface smart cards face challenges in providing effective and efficient integration of both contact and contactless interfaces, necessitating improved fabrication methods and structures for IC modules.
Innovation Solution
A non-conductive substrate with through holes, conductive pads, and traces, along with solder masks and solder pads, is used to create an IC module with direct chip attachment, allowing for both contact and contactless connections through separate conductive paths, and optionally incorporating biometric and LED circuitry.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If through holes are used to connect contact and contactless interfaces, then electrical interference is reduced, but manufacturing complexity increases
Solution Approach 1:
The substrate is divided into distinct functional zones with separate through holes for contact interface connections and contactless interface connections. This segmentation allows independent optimization of each interface type while maintaining physical separation to reduce electrical interference between the two interfaces.
Solution Approach 2:
A non-conductive substrate acts as an intermediary layer between the contact and contactless interfaces. The substrate with its controlled through hole structure mediates the connection while providing electrical isolation, thus reducing interference between the two interfaces without requiring direct contact between them.
2Reliability
If separate conductive paths are provided for contact and contactless interfaces, then interface performance is improved, but device complexity increases
Solution Approach 1:
Separate conductive paths are created by dividing the through holes into distinct groups - one set for contact interface connections and another set for contactless interface connections. This segmentation ensures independent signal paths that prevent interference while maintaining clear functional separation.
Solution Approach 2:
The conductive paths are arranged in different spatial dimensions and locations on the substrate. By utilizing the two-dimensional plane of the substrate effectively, separate conductive paths are established without requiring additional layers or complex three-dimensional structures.
3Object-affected harmful factors
If solder masks are applied to conductive traces, then electrical insulation is improved, but manufacturing steps increase
Solution Approach 1:
The solder mask application is combined with other substrate processing steps. The non-conductive substrate is prepared with integrated solder mask regions that coincide with the conductive trace locations, allowing simultaneous formation of both the substrate structure and the insulating layers in a coordinated manufacturing process.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables seamless integration of contact and contactless interfaces in smart cards, enhancing operational efficiency and versatility while maintaining mechanical integrity and reducing electrical interference.
Implementation Method 1
a first solder arranged in a first subset of the through holes and on a first subset of the through-hole solder pads, and configured to conductively couple a first subset of the conductive pads to a first subset of the conductive traces
Implementation Method 2
an underfill material interposed between the IC chip and the rear side of the substrate and/or an encapsulant provided on the IC chip
Implementation Method 3
an antenna conductively coupled to the antenna-connection pads, thereby conductively coupling the antenna to the IC chip
Implementation Method 4
a light emitting diode (LED) circuitry, which includes at least one LED module
Data Source
AI summary
The present disclosure relates to carrier tapes, IC modules, and smart card devices. According to one embodiment, an article of manufacture comprises: a non-conductive substrate having a front side and a rear side, and a plurality of through holes extending from the front side to the rear side; a smart card contact area arranged on the front side of the substrate and having a plurality of conductive pads which are mutually insulated and close front-side ends of the through holes; a plurality of through-hole solder pads and a plurality of conductive traces arranged on the rear side of the substrate, wherein the through-hole solder pads are arranged at rear-side ends of the through holes, wherein the conductive traces are conductively coupled to the through-hole solder pads respectively; and a solder mask at least partially overlaying the conductive traces.