Smart Card Module Laminate Structure for Thin Robust Design
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Solution Overview
Problem
Existing smart card modules face challenges in miniaturization and mechanical robustness due to large thickness and susceptibility to mechanical loading, with conventional integration methods like wire bonding and flip-chip mounting leading to instability and delamination issues.
Innovation Solution
A smart card module design featuring a chip with electrical contacts connected to a conductive layer, sandwiched between laminate layers and adhesive means, providing enhanced robustness and flexibility through conductive layer connections and lateral side webs, allowing for thin and robust module construction with total thicknesses under 200 μm.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If wire bonding is used to connect the chip, then electrical connectivity is achieved, but the total thickness of the module becomes large
Solution Approach 1:
The patent extracts the wire bonding step from the conventional process sequence and replaces it with direct conductive layer connection. The conductive layer is integrated into the laminate structure and directly contacts the chip pads, eliminating the need for wire bonds and their associated thickness. This extraction of the problematic element (wire bonding) directly reduces the module thickness while maintaining electrical connectivity function.
Solution Approach 2:
The patent merges the conductive function with the structural laminate layers. The conductive layer is integrated within the laminate stack-up, combining electrical conduction and mechanical support functions into a single integrated structure. This merging eliminates the need for separate wire bonding components and reduces overall module thickness.
2Length of stationary object
If flip-chip mounting is used to connect the chip, then the total thickness is reduced, but the module becomes highly susceptible to mechanical loading
Solution Approach 1:
The patent employs composite laminate structures that combine multiple materials with complementary properties. The laminate layers provide mechanical strength and rigidity to resist mechanical loading, while the conductive layers provide electrical connectivity. This composite approach allows the module to achieve both thin thickness (from the compact laminate structure) and high mechanical robustness (from the reinforced laminate layers).
Solution Approach 2:
The patent uses thin film laminate layers that provide both mechanical support and electrical functionality. The laminate structure acts as a flexible yet strong envelope that protects the chip while maintaining thin overall dimensions. The thin film conductive layers integrated into the laminate provide electrical connectivity without adding significant thickness.
3Strength
If frame adhesive bonding is used to stabilize the module, then flexural stiffness is improved, but the total thickness increases and delamination risk occurs
Solution Approach 1:
The patent merges the stabilization function with the existing laminate structure. The laminate layers themselves are designed to provide the necessary rigidity and flexural stiffness without requiring additional frame structures. The conductive layers are integrated into the laminate stack-up, combining structural support and electrical functionality in a single integrated design that avoids delamination risks associated with separate adhesive bonding.
Solution Approach 2:
The patent changes the structural parameters of the laminate layers to achieve the required flexural stiffness. By adjusting the composition, thickness, and arrangement of laminate layers, the module achieves high stiffness without requiring additional framing structures. This parameter optimization allows thin module construction while maintaining mechanical robustness.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables the creation of thin, robust, and cost-effective smart card modules with improved flexural stiffness and reduced risk of delamination, facilitating easier integration into smart cards while maintaining electrical connectivity.
Implementation Method 1
an adhesive means wherein the adhesive means is arranged between the chip and the conductive layer and/or the first laminate layer
Data Source
AI summary
A smart card module for a smart card, comprising a chip having electrical contacts at a front side; a first laminate layer, wherein a rear side of the chip is connected to the first laminate layer, the rear side of the chip opposite the front side; a second laminate layer; a first conductive layer, wherein the electrical contacts of the chip are connected to the first conductive layer and the first conductive layer is arranged between the chip and the second laminate layer; and an adhesive material arranged between the chip and the conductive layer and/or the second laminate layer.