Smart Card Module Antenna Wire Connection Method
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Solution Overview
Problem
The production of dual-interface chip cards is hindered by complex and unreliable methods for connecting the antenna to the electronic module, affecting productivity and reliability.
Innovation Solution
A method involving a substrate with contacts for temporary electrical connection, an electronic chip attached to the substrate, and wires directly connected to the chip and antenna, with the second end of the wire left outside the resin for direct connection to the antenna, simplifying the process and improving reliability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the antenna is connected to the electronic module using complex methods with intermediate conductors and connection lands, then the connection reliability is improved, but the device complexity and manufacturing difficulty increase
Solution Approach 1:
The patent removes intermediate conductors and connection lands from the antenna-module connection path. The wire is connected directly to the chip connection pad and directly to the antenna connection land, eliminating unnecessary intermediate elements and simplifying the connection structure while maintaining reliability.
Solution Approach 2:
Instead of connecting the wire to intermediate conductors first and then to the antenna, the patent inverts the connection approach by making the wire ends directly accessible for direct connection to both the chip and antenna, reversing the traditional multi-step connection process.
2Reliability
If the second end of the wire is encapsulated in resin like the first end, then the protection and insulation are improved, but the direct connection to the antenna becomes impossible
Solution Approach 1:
The patent applies different treatment to different ends of the wire: the first end connected to the chip is encapsulated in resin for protection, while the second end remains outside the resin for direct connection to the antenna. This local differentiation allows both protection and accessibility requirements to be satisfied simultaneously.
3Reliability
If complex connection methods with multiple intermediate steps are used, then the connection reliability is improved, but the productivity and manufacturing efficiency decrease
Solution Approach 1:
The patent segments the wire connection process into two independent direct connections: one from the wire first end to the chip connection pad, and another from the wire second end to the antenna connection land. This segmentation eliminates intermediate steps and enables parallel processing, improving manufacturing efficiency while maintaining connection reliability.
4Adaptability or versatility
If intermediate conductors and connection lands are used between the wire and antenna, then the connection flexibility is improved, but the manufacturing complexity and time increase
Solution Approach 1:
The patent positions the wire second end outside the resin during the encapsulation process itself, preparing it in advance for direct connection to the antenna. This preliminary positioning eliminates the need for subsequent intermediate connection steps, reducing manufacturing cycle time while maintaining connection flexibility.
Data Source
AI summary
The invention relates to a method for producing a chip card module. According to this method, the following are produced: a module with a substrate having contacts and an electronic chip connected to at least some contacts; an antenna on a carrier, this antenna including two ends, each equipped with a connection land; a cavity in at least one layer of the card at least partially covering the carrier, in order to house the module and to expose the connection lands of the antenna; a first end of a wire is connected directly to a connection pad of the chip, and another portion is connected directly to a connection land of the antenna, after having inserted the module into the cavity.