Smart Card IC Module Structure With Open Through-Holes for Heat Transfer
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing dual interface smart cards face challenges in providing effective and efficient integration of IC modules with both contact and contactless interfaces, as well as in addressing issues related to fabrication methods and structural integrity.
Innovation Solution
The integration of IC modules with direct chip attachment and underfill material, encapsulant-free through holes, biometric and LED circuitry, and inductive coupling for contactless operation, along with a laminated core structure and specific substrate designs, enhances the functionality and durability of smart cards.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If through holes are filled with encapsulant material to provide mechanical support, then mechanical strength is improved, but heat transfer capability deteriorates
Solution Approach 1:
The patent applies local quality by leaving specific regions (through holes) free of encapsulant material while filling other regions, creating localized variations in material properties. This allows through holes to maintain heat transfer pathways while other areas receive mechanical support from encapsulant.
Solution Approach 2:
The patent extracts encapsulant material from specific through hole regions, removing it selectively to preserve heat transfer capabilities in those locations while maintaining mechanical support in other areas through alternative structures.
2Device complexity
If IC chip is directly attached to substrate to reduce complexity, then device complexity is reduced, but mechanical stress on chip increases
Solution Approach 1:
The patent applies beforehand cushioning by introducing compliant underfill material between the IC chip and substrate before final assembly. This underfill material acts as a cushion to absorb and distribute mechanical stresses, protecting the chip from stress concentration while maintaining the direct attachment structure.
3Reliability
If contact area is enlarged to improve contact reliability, then contact reliability is improved, but area available for other components decreases
Solution Approach 1:
The patent applies another dimension by utilizing the vertical dimension through multi-layer substrate construction. Contact areas are distributed across different layers and planes, allowing sufficient contact reliability to be achieved without consuming excessive horizontal area on any single layer.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables reliable contact and contactless operations, improves heat transfer, and reduces mechanical stress on IC chips, while allowing for efficient fabrication and integration of additional features like biometrics and LEDs, thus enhancing the performance and durability of smart cards.
Implementation Method 1
improves heat transfer
Implementation Method 2
configured to be inductively coupled to a contactless reader to operate the at least one LED module
Data Source
Figure 1A~1D
Figure 1E~1G
Figure 2A~2C
AI summary
The present disclosure relates to carrier tapes, IC modules, and smart card devices. According to one embodiment, an article of manufacture comprises: a non-conductive substrate having a front side and a rear side, and a plurality of through holes extending from the front side to the rear side; a smart card contact area arranged on the front side of the substrate and having a plurality of conductive pads which are mutually insulated and close front-side ends of the through holes; a plurality of through-hole solder pads and a plurality of conductive traces arranged on the rear side of the substrate, wherein the through-hole solder pads are arranged at rear-side ends of the through holes, wherein the conductive traces are conductively coupled to the through-hole solder pads respectively; and a solder mask at least partially overlaying the conductive traces.