Smart Card PCB-Printed USB-C Interface for Wallet-Size Form Factors
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Solution Overview
Problem
Existing smart card devices face challenges in expanding functionality while maintaining a standard form factor due to size and cost constraints associated with traditional bus interface receptacles, which are bulky and add significant manufacturing complexity.
Innovation Solution
The bus interface is printed directly on the PCB of the smart card device, eliminating the need for a separate receptacle and incorporating a reinforcing metal layer to enhance durability, thereby reducing thickness and manufacturing costs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If a traditional bus interface receptacle is used, then connectivity functionality is provided, but the device thickness and manufacturing complexity increase
Solution Approach 1:
The bus interface receptacle is merged with the PCB by printing the receptacle structure directly onto the PCB surface. This integration eliminates the need for a separate receptacle component, reducing device thickness while maintaining connectivity functionality. The printed receptacle becomes an inherent part of the PCB structure rather than an add-on component.
Solution Approach 2:
The traditional mechanical receptacle structure is replaced with a printed circuit board integration approach. Instead of assembling a separate mechanical receptacle onto the PCB, the receptacle is created through PCB printing processes, substituting mechanical assembly with a more integrated manufacturing method that reduces overall device thickness.
2Adaptability or versatility
If a traditional bus interface receptacle is used, then connectivity functionality is provided, but manufacturing cost and complexity increase
Solution Approach 1:
The receptacle manufacturing process is merged with the PCB manufacturing process. By printing the receptacle directly on the PCB, the invention eliminates separate receptacle production and assembly steps, thereby reducing manufacturing complexity and cost while maintaining the required connectivity functionality.
Solution Approach 2:
The PCB serves multiple functions: it provides the circuit board structure, hosts electronic components, and integrates the bus interface receptacle. This multi-functionality reduces the total number of components and assembly steps, simplifying manufacturing and reducing costs while maintaining connectivity capability.
3Ease of manufacture
If the PCB structure is used without reinforcement, then manufacturing simplicity is maintained, but structural durability decreases
Solution Approach 1:
The PCB structure is enhanced by incorporating a reinforcing metal layer into the composite structure. This creates a multi-layer composite material system where the metal layer provides structural strength and durability while the PCB layers maintain electrical functionality and manufacturing simplicity. The composite structure achieves both durability and ease of manufacture.
Data Source
AI summary
This disclosure a smart card device that provides a bus interface, such as a USB-C bus interface, printed on a portion of a PCB that forms a base layer of the smart card device. The smart card device can provide the bus interface without having to mount a traditional socket. By leveraging the portion of the PCB to provide a printed bus interface and excluding the traditional socket, the bus interface can be easily manufactured using well-known PCB manufacturing techniques while significantly reducing manufacturing costs. Furthermore, the smart card device can have a thickness that conforms to known card form factor standards, enabling the smart device to fit within a standard wallet. To enhance durability of the portion of the PCB from wear-and-tear, a metal core can be added to the PCB as an additional layer. The portion may also be reinforced with edge plating.