Smart Card Circuit Board Via Bonding Without Plating
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Solution Overview
Problem
The existing via plating process for connecting circuit patterns on a circuit board is inefficient due to long process times and requires a separate plating layer, which deteriorates manufacturing efficiency.
Innovation Solution
A circuit board with a substrate having one surface with a first circuit pattern and another surface with a second circuit pattern, where at least one via is formed to wire-bond the patterns for electrical conductivity, omitting the need for a via plating layer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If via plating process is used to connect circuit patterns on both surfaces, then electrical connection is achieved, but process time increases and manufacturing efficiency deteriorates
Solution Approach 1:
The patent extracts and eliminates the via plating process from the manufacturing flow, replacing it with direct wire bonding through vias. This removes the harmful plating step while maintaining the essential electrical connection function, thereby improving manufacturing efficiency without sacrificing reliability.
Solution Approach 2:
The patent replaces the electrochemical via plating process with a mechanical wire bonding approach. Instead of using chemical deposition to create conductive paths, the invention uses physical wire insertion and bonding through vias, substituting a complex electrochemical system with a simpler mechanical one.
2Reliability
If via plating layer is formed to conduct electricity between circuit patterns, then electrical conductivity is achieved, but process complexity and time increase
Solution Approach 1:
The patent extracts the plating layer formation step from the via processing sequence, keeping only the essential via hole creation and wire bonding steps. This elimination of the plating process reduces overall process complexity while maintaining electrical conductivity through the wire-bonded vias.
3Reliability
If connection region is dispersed across multiple first circuit patterns, then electrical connections are established, but molding member area increases reducing adhesive region
Solution Approach 1:
The patent merges multiple connection regions into a single concentrated area by routing all wire bonds through a unified bonding pad structure. This consolidation reduces the total area occupied by connection regions, thereby increasing the available adhesive region for mounting the circuit board to the card body.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach allows for efficient electrical connection between the circuit patterns, reduces the area of the molding member, and enhances adhesion between the circuit board and the card body by increasing the adhesive region, thereby improving manufacturing efficiency and adhesion.
Implementation Method 1
at least one via is formed in the substrate, and the first circuit pattern and the second circuit pattern are wire-bonded through the via to conduct electricity
Data Source
AI summary
A circuit board according to an embodiment includes: a substrate including one surface and the other surface; a first circuit pattern disposed on the one surface; and a second circuit pattern disposed on the other surface, wherein at least one via is formed in the substrate, and the first circuit pattern and the second circuit pattern are wire-bonded through the via to conduct electricity.