Smart Card Wire Anchoring for Tearing Prevention
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Solution Overview
Problem
Existing methods for manufacturing smart cards with integrated circuit chips and electrical connection wires fail to provide effective anti-tearing functionality, leading to damage of wires during module removal, which complicates easy transport and storage.
Innovation Solution
A method involving anchoring electrical wires to the support body using a secondary anchoring material, where the wire is hooked and anchored during the manufacturing process, ensuring that upon attempted separation, the wire is cut, preventing detachment of the chip from the contact pads and dielectric support film.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If structural bonding or mechanical anchoring is used to fix the module, then the chip is securely anchored to the support body, but the wires remain bare and vulnerable to damage during transport and storage
Solution Approach 1:
The patent applies preliminary action by pre-coating the chip and wires with protective material before anchoring, and by pre-positioning the module in the cavity with the anchoring material already in place. This ensures that the wires are protected before any damage could occur during subsequent handling or transport.
Solution Approach 2:
The patent uses composite materials by combining the anchoring material with protective coating material. The anchoring material serves dual functions: it mechanically anchors the chip and wires to the support body while simultaneously coating and protecting the wires. This composite approach resolves the contradiction by making the anchoring process itself protective rather than exposing the wires.
2Ease of operation
If the module is made removable for transport and storage, then ease of handling is improved, but the chip can be detached from the contact pads and support film
Solution Approach 1:
The patent applies preliminary anti-action by creating an irreversible anchoring connection between the module and support body. The anchoring material is positioned to intercept and secure the wires before any removal attempt, preventing the module from being detached. This preliminary protective measure ensures that even if someone attempts to remove the module for transport, the wires will be cut rather than allowing module detachment.
Data Source
Figure 1~4
Figure 5~8
AI summary
The invention relates to a method for manufacturing an electronic device (13a, 13b), including a module (1, 15) attached in a recess of a carrier body, said module including a backing film (2) having a metal coating (3) on an upper surface side and on a lower surface side, an integrated-circuit chip (6) connected to the metal coating using electric connection wires (7, 8), the integrated-circuit chip being coated with a coating and mechanically protective material (9). The method is characterized in that it includes an anchoring step according to which a second anchoring material (11) is provided for bonding a portion (7p, 8p, 17p, 18p) of at least one of said electric wires and for anchoring said wire portion to the carrier body.