Smart Card Wire Pad Design With 3D Bridging for Dense Contacts
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Solution Overview
Problem
The challenge in smart card design is to increase the density of connection pads without impairing their functionality, given the limited space and ISO/IEC standards constraints.
Innovation Solution
A wire pad design featuring a connection pad wiring pattern with plural wire portions and a bridging wire portion extending outside the contacting pad plane, maintaining electrical connections through a bridging wire portion even when the pattern is partially removed during module integration.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If the density of connection pads is increased to maximize space utilization, then the area coverage is improved, but the reliability of electrical connections deteriorates due to tighter spacing and potential contact issues
Solution Approach 1:
The patent transitions from a two-dimensional planar wire pad design to a three-dimensional design by adding a bridging wire portion that extends vertically outside the contacting pad plane. This dimensional change allows the wire portions to be connected in 3D space rather than confined to a flat surface, enabling higher density placement while maintaining connection reliability through the elevated bridging structure that avoids interference with module terminals
Solution Approach 2:
The connection pad is segmented into distinct components: wire portions lying in the contacting pad plane and a separate bridging wire portion extending outside this plane. This segmentation allows the wire portions to be densely packed in the 2D plane while the bridging portion provides a separate 3D connection path, resolving the conflict between density and reliability
2Reliability
If the wire pad area is enlarged to ensure reliable contacting, then the connection reliability is improved, but the device complexity increases due to larger pad structures occupying more space
Solution Approach 1:
Instead of enlarging the wire pad area in the 2D contacting pad plane, the patent extends the connection into the 3D dimension by adding the bridging wire portion. This allows reliable electrical connection to be achieved through vertical extension rather than horizontal expansion, reducing the footprint and overall device complexity while maintaining contacting reliability
Solution Approach 2:
The bridging wire portion serves multiple functions: it provides the electrical connection path, acts as a mechanical bridge between wire portions, and extends outside the contacting pad plane to avoid interference with module terminals. This multi-functionality reduces the need for separate structural elements, simplifying the overall pad structure
Data Source
AI summary
In aspects, the present invention relates to a wire pad design of a connection pad in a prelam body of a smart card, to a prelam body with at least one such connection pad embedded into a substrate, to a smart card comprising such a prelam body, to a method of forming a wire pad design of a connection pad of a prelam body of a smart card, and to a method of forming a smart card. In some illustrative embodiments, a wire pad design of a connection pad in a prelam body of a smart card is provided, the wire pad design comprising a connection pad wiring pattern formed by plural wire portions extending in a contacting pad plane, and a bridging wire portion which at least partially extends outside the contacting pad plane. The bridging wire portion electrically and mechanically connects at least some of the plural wire portions with each other.