Smart Card Wire Pad Design with Bridging Wires for Dense Contacts
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The challenge in smart card design is to increase the density of connection pads without compromising their functionality, given the limited space and the need to comply with ISO/IEC standards, especially when integrating multiple I/O terminals.
Innovation Solution
A wire pad design featuring a bridging wire portion that maintains electrical connection among disconnected wire portions, allowing for a compact and high-density connection pad layout with varying wiring density and a spirally shaped routing pattern, optionally with a recess in the substrate to accommodate the bridging wire.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If conventional wire pad designs are used with increasing number of I/O terminals, then the functionality of smart cards is improved, but the placement density of contact terminals deteriorates and becomes increasingly difficult to place without impairing proper functioning
Solution Approach 1:
The wire pad is segmented into multiple wire portions (first wire portion, second wire portion, third wire portion) that can be independently routed and connected to different I/O terminals. This segmentation allows each wire portion to be optimally positioned and routed to its respective terminal, enabling higher placement density while maintaining proper functioning of each contact terminal.
2Productivity
If the density of connection pads is increased to utilize limited card space, then the productivity and functionality are improved, but the reliability of electrical contact may deteriorate
Solution Approach 1:
Different wire portions are routed through different regions of the card body substrate, allowing each wire portion to have optimal local routing characteristics. The first wire portion is routed through a first region, the second wire portion through a second region, and the third wire portion through a third region, ensuring that each connection maintains reliable electrical contact despite the high overall density of connection pads.
3Area of stationary object
If wire portions are routed densely to achieve high connection pad density, then the area utilization is improved, but the risk of disconnection during module integration increases
Solution Approach 1:
The wire portions are routed through different spatial dimensions and regions of the card body substrate. The first wire portion extends in a first direction through a first region, the second wire portion extends in a second direction through a second region, and the third wire portion extends in a third direction through a third region. This multi-dimensional routing strategy distributes the electrical connection paths across different spatial domains, reducing the risk that dense routing in a single plane will cause disconnections during module integration.
Data Source
Figure 1~2
Figure 3
Figure 4~5
AI summary
In aspects, the present invention relates to a wire pad design of a connection pad in a prelam body of a smart card, to a prelam body with at least one such connection pad em- bedded into a substrate, to a smart card comprising such a prelam body, to a method of forming a wire pad design of a connection pad of a prelam body of a smart card, and to a method of forming a smart card. In some illustrative embodiments, a wire pad design of a connection pad in a prelam body of a smart card is provided, the wire pad design comprising a connection pad wiring pattern formed by plural wire portions extending in a contacting pad plane, and a bridging wire portion which at least partially extends outside the contacting pad plane. The bridging wire portion electrically and mechanically connects at least some of the plural wire portions with each other.