Smart Connector Packaging With PCB Modularity for Heat and Current
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Solution Overview
Problem
The existing Application Specific Electronics Packaging manufacturing processes for power electronics are costly and inefficient in handling high currents and thermal management, requiring bulky and expensive solutions like heat pipes, and face challenges in adapting to changing feature and performance requirements due to the need for new stamping dies and molds.
Innovation Solution
A smart connector is formed using an Application Specific Electronics Packaging manufacturing process that integrates a highly conductive Application Specific Electronics Packaging device with a separate printed circuit board, allowing for efficient heat removal and flexible adaptation to different applications by modifying the printed circuit board without retooling the expensive device, thus reducing capital costs and improving thermal management.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If Application Specific Electronics Packaging manufacturing process is used to integrate connector functions into electronics module, then manufacturing cost and device size are reduced, but adaptability to changing feature requirements deteriorates due to need for new stamping dies and molds
Solution Approach 1:
The connector is divided into two separate components: the ASEP device (containing metal contacts, substrate, and electrical components) and the printed circuit board. This segmentation allows the ASEP device to be manufactured once with fixed stamping dies and molds, while the PCB can be independently modified for different applications, thus maintaining low manufacturing cost while improving adaptability.
Solution Approach 2:
The ASEP device is designed as a universal platform that can be paired with different printed circuit boards to serve multiple applications. The standardized interface and electrical connection methods allow the same ASEP device to function across various connector types and applications, reducing the need for application-specific customization of the expensive ASEP device.
2Temperature
If heat pipes are used to remove heat from power electronics, then heat removal capability is improved, but device size and cost increase
Solution Approach 1:
The thermal management function is merged with the structural substrate of the ASEP device. The substrate itself serves as the heat sink, eliminating the need for separate heat pipe components. This integration maintains effective heat removal while significantly reducing the overall device volume and eliminating redundant components.
Solution Approach 2:
The heat removal function is extracted from the power electronics assembly and integrated directly into the ASEP device substrate. By making the substrate highly thermally conductive and directly attaching power devices to it, the patent removes the need for external heat pipes while maintaining or improving heat removal efficiency.
3Power
If thick Cu PCBs with 3 to 5-ounce Cu traces are used to carry high currents, then current carrying capability is improved, but manufacturing cost and electrical resistance increase
Solution Approach 1:
The patent replaces the traditional thick Cu PCB mechanical structure with a hybrid ASEP device that uses highly conductive metal contacts and optimized trace geometry. This substitution achieves superior current carrying capability (100 to 500 Amps) with lower electrical resistance while using standard-thickness substrates, eliminating the need for expensive thick copper PCBs.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces electrical resistance, enhances heat removal efficiency, and allows for cost-effective production and customization of high-power applications by separating the printed circuit board's functionality from the Application Specific Electronics Packaging device, enabling the same device to be used across multiple applications with minimal additional capital investment.
Implementation Method 1
by directly attaching the power devices that generate some of the heat to a highly thermally conductive metal, Application Specific Electronics Packaging devices enable the removal of the heat that is still generated in a much more efficient way
Implementation Method 2
The Application Specific Electronics Packaging manufacturing process includes forming a continuous carrier web having a plurality of lead frames, overmolding a substrate onto the fingers of each lead frame, electroplating the traces
Data Source
AI summary
In an embodiment, a smart connector includes an Application Specific Electronics Packaging device formed by an Application Specific Electronic Packaging manufacturing process, and a separate printed circuit board electrically connected to electrical components of the Application Specific Electronic Packaging device. The Application Specific Electronic Packaging manufacturing process includes forming a continuous carrier web having a plurality of lead frames, overmolding a substrate onto the fingers of each lead frame, each substrate having a plurality of openings which exposes a portion of the fingers, electroplating the traces, and electrically attaching at least one electrical component to the traces to form a plurality of Application Specific Electronic Packaging devices. In some embodiments, the printed circuit board has electrical components configured to control the functionality of the electrical components. In some embodiments, the printed circuit board has electrical components configured to modify properties of the smart connector.