Articulated Smart Glasses Temple for Heat Dissipation

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Solution Overview

Problem

Heat management in wearable electronic devices is challenging due to space and weight constraints, leading to potential failure or discomfort from localized heating, especially when worn against the user's body.

Innovation Solution

Incorporating a core wire as a heat sink within the temple and frame of smart glasses, utilizing a thermal coupling across an articulated joint to dissipate heat generated by onboard electronic components, including a cap hinge and internal heat sinks for effective heat transfer.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Volume of moving object

If onboard electronic components are housed in a smaller size to meet volume constraints, then device compactness is improved, but heat management capability deteriorates

Engineering Contradiction:
Improvedevice volumeVSAvoidheat management
Core Design Contradiction:
Volume of moving objectVSTemperature

Solution Approach 1:

The patent extends the heat dissipation pathway from the electronic components through the temple structure to the ear, utilizing the third dimension (length along the temple) to provide adequate heat transfer surface area without increasing the volume of the housing containing the electronics. This allows compact electronics housing while maintaining effective heat management.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

2Temperature

If heat dissipation surface area is increased to improve heat management, then temperature control is improved, but device weight increases

Engineering Contradiction:
Improveheat dissipationVSAvoiddevice weight
Core Design Contradiction:
TemperatureVSWeight of moving object

Solution Approach 1:

The temple structure serves multiple functions: it provides structural support for wearing the device, acts as a heat dissipation pathway, and contributes to the overall device aesthetics. By making the temple multi-functional, the patent avoids adding separate heat dissipation components that would increase weight, instead utilizing the existing temple structure for thermal management.

Inventive Principle:
Principle #6Universality (Multi-functionality)

3Temperature

If heat dissipation surface area is increased to improve heat management, then temperature control is improved, but device complexity increases

Engineering Contradiction:
Improveheat dissipationVSAvoiddevice complexity
Core Design Contradiction:
TemperatureVSDevice complexity

Solution Approach 1:

The patent combines the heat dissipation function with the existing temple structure by thermally coupling the electronic components to the temple. This merging of functions eliminates the need for separate heat dissipation components and simplifies the overall device design while achieving effective thermal management.

Inventive Principle:
Principle #5Merging (Combining)

4Ease of operation

If electronics are positioned closer to the user's body for wearability, then ease of operation is improved, but harmful thermal effects worsen

Engineering Contradiction:
ImprovewearabilityVSAvoidthermal discomfort
Core Design Contradiction:
Ease of operationVSObject-affected harmful factors

Solution Approach 1:

The patent extracts the heat from the vicinity of the user's face by providing a dedicated heat dissipation pathway through the temple structure that conducts heat away from the electronic components and away from the user's face to the ear, thereby eliminating thermal discomfort while maintaining wearability.

Inventive Principle:
Principle #2Taking out (Extraction)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Effectively reduces localized heating, ensuring the reliability and comfort of wearable electronic devices by efficiently transferring heat away from the user's face, maintaining device performance and user comfort.

Implementation Method 1

utilizing a thermal coupling across an articulated joint to dissipate heat generated by onboard electronic components

Methodology Applied
Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 2

Incorporating a core wire as a heat sink within the temple and frame of smart glasses

Methodology Applied
Scientific EffectHeat sink: Heat Sink

Implementation Method 3

a thermal coupling can extend across an articulated joint (e.g., a hinge assembly) between the temple and the frame to provide part of a heat conduction path

Methodology Applied
Scientific EffectThermal coupling: Conduction (thermal)

Data Source

PatentUS12554147B2Wearable electronic device with articulated joint
Publication Date: 2026.02.17 SNAP INC
  • US12554147B2 patent drawing
  • US12554147B2 patent drawing
  • US12554147B2 patent drawing

AI summary

Apparatuses, systems for electronic wearable devices such as smart glasses are described. The wearable device can comprise a frame, an elongate temple and an articulated joint. The frame can define one or more optical element holders configured to hold respective optical elements for viewing by a user in a viewing direction. The temple can be moveably connected to the frame for holding the frame in position when the device is worn by the user. The articulated joint can connect the temple and the frame to permit movement of the temple relative to the frame between a wearable position in which the temple is generally aligned with the viewing direction, and a collapsed position in which the temple extends generally transversely to the viewing direction. The articulated joint can include a base foot fixed to the frame and oriented transversely to the viewing direction.